IH soldering
IH soldering
We would like to introduce the "IH soldering" that we conduct.
1～8 item / All 8 items
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Overcoming the challenges of soldering: "IH Soldering Device" [Case Study]
Since it heats metal non-contact, soldering is possible even with a "4mm" wall terminal! We will also introduce examples of achieving soldering on a 6-layer thick copper substrate.
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[IH Soldering Case] Large Heat Capacity Substrate
A field where the IH method excels! Introducing a case study that achieved soldering on a 6-layer thick copper substrate.
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【IH Soldering Example】Wall Terminal
Introducing a case where soldering was made possible even with a distance of 4mm between the resin case and the terminal!
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A 3D local heating IH soldering device that can also accommodate characteristic substrates!
Capable of outputting a large amount of heat, it can handle a wide range of substrates with just "one unit"! Compliant with various regulations such as ICNIRP and the Radio Law, 'S-WAVE301H'.
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3D local heating device 'S-WAVE' compatible with characteristic bases.
Three evolving lineups that meet the needs of the times! Introducing the 3D local heating device.
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IH soldering device "S-WAVE FBA series"
Equipped with loader/unloader! Targeting inline processes after soldering and multi-product production, etc.
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3D Local Heating Device 'S-WAVE301A'
Rapidly heating a narrow spot to 300℃! Compliant with various regulations such as ICNRP and the Radio Law.
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3D Localized Heating Device "S-WAVE301"
Achieving high continuous operation performance! Increased cooling power extends heating time during high output.
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