[IH Soldering Case] Large Heat Capacity Substrate
A field where the IH method excels! Introducing a case study that achieved soldering on a 6-layer thick copper substrate.
We would like to introduce a case of IH soldering on a large heat capacity substrate for automotive products. With the rise of electric vehicles (EVs), the use of large heat capacity substrates in automotive components has increased. The IH method not only heats the terminals but also the large patterns and solder, significantly improving soldering quality. IH soldering is a specialty in the field of large heat capacity substrates. 【Case Overview】 ■ Heating Target ・ 6-layer thick copper substrate ・ □0.64 *For more details, please refer to the PDF document or feel free to contact us.
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