High-speed, high-durability valve for ALD processes: "TDF Series"
High-speed opening and closing with high response stability! Capable of accommodating special face-to-face dimensions, valve shapes, and corrosion-resistant material bodies.
The "TDF Series" is a high-purity gas diaphragm valve that combines high-speed opening and closing, high durability, corrosion resistance, heat resistance, and Cv stability, all of which are necessary for the ALD (Atomic Layer Deposition) process. It adopts a structure that reduces thermal conduction to the actuator, making it suitable for high-temperature fluids up to 220°C. The Cv values are adjusted for all units at the time of factory shipment, resulting in minimal variation in Cv values during use and stable gas flow. 【Features】 ■ High-speed opening and closing with high response stability #High response ■ Compatible with high-temperature fluids ■ Stable Cv values ■ High durability ■ Suitable for high-purity gases *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Other Features】 - Achieves a valve response time of 18ms and response stability of ±2ms after durability testing (based on our testing method results). - Adopts a structure that reduces thermal conduction to the actuator, allowing use with high-temperature fluids up to 220°C (up to 200°C when equipped with solenoid valves and sensors). - Ensures Cv0.5 at 220°C by employing a structure and seat material that consider thermal effects (Cv value initial error and usage fluctuation rate within ±5%). - Our proprietary technology enables durability of over 40 million cycles with high-temperature fluids at 220°C. - Achieved durability test results of over 100 million cycles (based on our testing results under the following conditions: fluid: N2, sealing pressure: 0.25MPa (G), gas contact part temperature: 220°C). *KITZ SCT offers various solutions for fluid-related challenges in semiconductor manufacturing. For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.