Power Device & Module EXPO (Nepcon Japan)

ケイエルブイ

We will be exhibiting at the 2nd Power Device & Module EXPO (Nepcon Japan) to be held at Tokyo Big Sight from January 22 (Wednesday) to January 24 (Friday), 2025. We plan to introduce Cooliblade's cooling elements as thermal management solutions for power electronics.

Date and time Wednesday, Jan 22, 2025 ～ Friday, Jan 24, 2025
10:00 AM ～ 05:00 PM
Capital Tokyo Big Sight East Exhibition Hall
Entry fee Free For details on pre-registration, please check the official exhibition website.

Related product information

Cooling module CooliBlade for power electronics
High-efficiency cooling technology: An optimal cooling solution for thermal management of high-power electronic devices.

Product Model ■AURORA (Forced Air Cooling) Cooling modules for power modules, IGBT power semiconductors, PCBs, and components. Suitable for applications with limited installation space. ■ULTIMA (Forced Air Cooling) Suitable for air cooling of industrial control equipment, AC drives, inverters/converters, and renewable energy-related equipment using IGBT and SiC power semiconductors and power devices. Capable of handling high power (KW level). Evaluation kits are available. Customization options are also possible. For more details, please refer to the catalog and product page.

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