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Notice of Participation in the 'Implementation and Assembly Process Technology Exhibition' from July 10 to 11
Specialized in post-process automation! Introducing new equipment aimed at labor-saving for major domestic equipment manufacturers. Our company will be exhibiting at the "Assembly and Manufacturing Process Technology Exhibition 2024" held at the Nagoya City Small and Medium Enterprise Promotion Hall. This exhibition focuses on post-process automation and will showcase new equipment aimed at labor-saving for major domestic equipment manufacturers. We sincerely look forward to your visit. 【Event Overview (Excerpt)】 ■ Dates: July 10 (Wednesday) - 11 (Thursday), 2024 ■ Hours: 10:00 AM - 5:00 PM *Last admission at 4:00 PM ■ Admission Fee: Free - General visitors: No registration required for factory representatives from manufacturing industries or equipment/product users (please submit two business cards at the reception) - Trading companies: Pre-registration is required.
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Announcement of the Opening of MUSUBI Satellite Lab WEST (Joint Venture of 7 Companies)
The collaborative project "MUSUBI," which hosts the Implementation and Assembly Process Technology Exhibition, has recently established an "experimental lab" in the Kansai region, not just a showroom, with seven equipment manufacturers. We encourage you to bring your circuit boards to the lab and conduct verifications and experiments using the manufacturers' products. 【Exhibiting Manufacturers (7 companies)】 ■ Aibit Corporation ■ Koki Tech Co., Ltd. ■ Japan Plasma Treat Co., Ltd. ■ Hitachi Research Institute ■ Marantz Electronics Corporation ■ Meishou Co., Ltd. ■ Rexxam Co., Ltd. For more details, please refer to the PDF document.
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【38th NePCON Japan 2024 Exhibition Schedule】Developing a high-quality selective soldering machine 'SELBO-III' that enables flexible configurations.
Flow soldering is a method that has been adopted for surface soldering for a long time, but it has faced challenges such as requiring significant time and technical expertise for equipment maintenance, as well as high power consumption and solder material usage. Our company has developed a lineup that meets customer needs, ranging from tabletop to inline soldering equipment, and has been engaged in the development, manufacturing, and sales of selective soldering equipment as an expert in the field. The current "SELBO-II" has achieved sales of over 250 units since its launch, and we are currently developing the "SELBO-III" tailored to customer requirements. While the "SELBO-II" uses a line-wide control system, this product is being developed to enable a flexible equipment configuration with control via standalone modules. This product is scheduled to be exhibited at the "38th Nepcon Japan" to be held in January 2024. For more details, please refer to the PDF.
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Notice of participation in the "Implementation and Assembly Process Technology Exhibition 2023" hosted by MUSUBI from August 3 (Thursday) to August 4 (Friday), 2023.
Koki Tech Co., Ltd. will be exhibiting at the "Implementation and Assembly Process Technology Exhibition 2023" organized by MUSUBI, held at the Tsugawa Mirai-kan Apio Iwate Industrial Culture Center event hall. The trend of automation in production processes is expanding beyond just the SMT process to include flow processes, coating processes, and assembly processes. Automation is expected to reduce human errors caused by manual labor and enable traceability management of inspection results. At this exhibition, we will have booths that clearly introduce the main equipment of various companies aimed at labor-saving, as well as various initiatives such as SMT zones, UV zones, and panel display sales booths. We sincerely look forward to your visit.
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MUSUBI proposes automation of the downstream process at the "Implementation and Assembly Process Technology Exhibition" in Kitakyushu (Denpa Shimbun).
A news article regarding the "2023 Implementation Assembly Process Technology Exhibition (May 18-19)" hosted by MUSUBI, in which our company also participated, has been published in the Denpa Shimbun, so please take a look. We appreciate your continued support for the MUSUBI exhibition and Koki Tech.

About弘輝テック
-Soldering Future-
In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."