Kyouden Co., Ltd. will be exhibiting at the "Monozukuri World <Kyushu> 1st Monozukuri ODM/EMS Exhibition" held at Intex Osaka. We will introduce our completely in-house one-stop solution that achieves overwhelming short lead-time manufacturing, the features of our EMS business due to the establishment of a new factory, advanced equipment that enables production from small to large quantities, and a variety of products such as 5G and high-frequency substrates and high thermal conductivity substrates tailored to the needs of the times. We look forward to your visit. For more details, click here.

In the era of developing electronic devices, the issue of noise has become unavoidable. However, in addition to the fact that noise is a difficult phenomenon to understand, there is also the reality that with the retirement of the veteran generation, there are fewer people around who are knowledgeable about noise issues. This seminar will introduce participants to the understanding of noise as an electrical physical phenomenon, points to consider for high-speed wiring on printed circuit boards, and measures for cables and enclosures when assembling sets, across three sessions. In this final session, following "Understanding Noise from a Physical Perspective" and "GND and Return Current," we will discuss shielding, which is commonly used as a noise countermeasure, focusing particularly on the shielding functions of cable shields and metal enclosures.

Kyouden Co., Ltd. will be exhibiting at the "Monozukuri World <Osaka> 2nd Monozukuri ODM/EMS Exhibition" held at Intex Osaka. We will introduce our completely in-house one-stop solution that achieves overwhelming short lead-time manufacturing, the features of our EMS business due to the establishment of a new factory, advanced equipment that enables production from small to large quantities, and a variety of products such as substrates for 5G and high-frequency applications, as well as high thermal conductivity substrates that meet the needs of the times. We look forward to your visit.

In the development of electronic devices, the issue of noise has become an unavoidable reality. However, in addition to the fact that noise is a difficult phenomenon to understand, there is also the reality that with the retirement of the veteran generation, there are fewer people around who are knowledgeable about noise issues. This seminar will introduce participants over three sessions, covering everything from understanding noise as an electrical physical phenomenon, to considerations for high-speed wiring on printed circuit boards, and measures for cables and enclosures when assembling sets. This time, as the second session following the first session "Physics for Understanding Noise," we will discuss the important topic of "GND and Return Current" in noise design. ------------------------------------------------------------------------- For details and registration, click here ▼ https://www.kyoden.co.jp/kyoden_times/times20230801/ -------------------------------------------------------------------------

In the development of electronic devices, the issue of noise has become an unavoidable challenge. However, in addition to the fact that noise is a difficult phenomenon to understand, there is also the reality that with the retirement of the veteran generation, there are fewer people around who are knowledgeable about noise issues. This seminar will cover, over three sessions, everything from understanding noise as an electrical physical phenomenon, to considerations for high-speed wiring on printed circuit boards, and measures for cables and enclosures when assembling sets. ------------------------------------------------------------------------- For details and registration, click here ▼ https://www.kyoden.co.jp/kyoden_times/times20230613-01/ -------------------------------------------------------------------------

We have developed a substrate suitable for heat dissipation measures for high heat dissipation components such as power semiconductors, using our unique high-speed thick copper plating technology. This product allows for flexible design in terms of shape and size due to the use of thick copper plating, and it can accommodate thin plate structures of less than 0.4mm for power semiconductors, which was difficult with conventional aluminum substrates, copper base substrates, and the recent trend of copper inlay substrates, as well as build-up layer configurations.

Our company has established narrow adjacent mounting technology to address various challenges in electronic devices that are becoming more high-functioning and compact. By verifying optimal conditions based on factors such as the mounter, component adjacent spacing, metal mask thickness and aperture diameter, component pad size, and component layout, we have established narrow adjacent mounting technology. Additionally, we contribute to solving challenges in enhancing functionality and miniaturization of electronic devices through the use of simulations during the design phase and total solutions via multi-layer build-up substrate manufacturing.