We have developed a substrate suitable for heat dissipation measures for high heat dissipation components such as power semiconductors, using our unique high-speed thick copper plating technology. This product allows for flexible design in terms of shape and size due to the use of thick copper plating, and it can accommodate thin plate structures of less than 0.4mm for power semiconductors, which was difficult with conventional aluminum substrates, copper base substrates, and the recent trend of copper inlay substrates, as well as build-up layer configurations.

Our company has established narrow adjacent mounting technology to address various challenges in electronic devices that are becoming more high-functioning and compact. By verifying optimal conditions based on factors such as the mounter, component adjacent spacing, metal mask thickness and aperture diameter, component pad size, and component layout, we have established narrow adjacent mounting technology. Additionally, we contribute to solving challenges in enhancing functionality and miniaturization of electronic devices through the use of simulations during the design phase and total solutions via multi-layer build-up substrate manufacturing.