Leave it to us for printed circuit boards! Technology development to meet new market needs.
Leave it to us for all your substrate needs! We respond to various requests regarding substrates and provide direct support at any stage.
Our company is engaged in technology development with an eye toward the future, collaborating with material and component manufacturers to meet the needs of new technological areas and markets. Leveraging our advanced technological capabilities, we provide products that meet customer needs, ranging from general through-hole substrates to high-density wiring substrates for smartphones, high-frequency support that underpins the evolution of IoT and mobility, heat dissipation solutions that are robust in harsh environments, and flexible substrates. Additionally, we are also developing high heat dissipation high-frequency substrates using a "high-speed thick copper plating method" that contributes to heat dissipation measures for power semiconductors and high heat dissipation high-frequency components. 【Products Offered】 ■ High-density wiring substrates ・ Build-up substrates ・ IVH substrates ・ Any-layer substrates ■ High-frequency support/heat dissipation substrates ■ Flexible substrates *For more details, please refer to the related links or feel free to contact us.
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【Reliability Verification of the Substrate】 ■ Hot Oil Test: 260℃ for 10 seconds → 20℃ for 20 seconds, 100 cycles ■ Thermal Shock Test: -40℃ (30 minutes) ⇔ 125℃ (30 minutes), 500 cycles ■ Solder Heat Resistance Test: Float in a 260℃ solder bath for 10 seconds, 5 cycles *For more details, please refer to the related links or feel free to contact us.
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For more details, please refer to the related links or feel free to contact us.
