Build-up substrate
Build-up substrate
The build-up method is a process for manufacturing multilayer printed circuit boards by stacking layers, performing laser drilling, and forming wiring and vias repeatedly for each layer. By using build-up substrates, the following advantages can be achieved: ● Smaller substrate size ● Stronger against noise ● Capable of carrying large currents ● High design flexibility
1～3 item / All 3 items
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Printed Circuit Board Manufacturing - Build-Up Boards
We achieve miniaturization, slimness, and high functionality of electronic devices with Kyoden's build-up substrates!
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"0201" SMD chip compatible 6-layer (2-2-2) build-up substrate
Corresponding to the 'density' of components! High-frequency build-up substrate.
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[Free Materials Available!] Can't Ask Now! Build-Up Substrate
We will provide a free handbook that covers the basic knowledge of build-up substrates, their benefits, and actual case studies!
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