"0201" SMD chip compatible 6-layer (2-2-2) build-up substrate
Corresponding to the 'density' of components! High-frequency build-up substrate.
What supports KyoDen's narrow adjacent mounting technology is not just the mounting technology itself. It is unique to KyoDen that we can also offer solutions from substrate manufacturing technology, design, and analysis.
basic information
♢ Compatible with 0.4mm pitch BGA ♢ Compatible with "0201" SMD chips ♢ High-reliability high-frequency materials and multi-layer build-up PCBs Optimal placement of decoupling capacitors based on analysis during design. Multi-layer build-up using high-frequency materials. We provide a one-stop service from design to implementation. *For more details, please refer to the related links or feel free to contact us.*
Price range
Delivery Time
Applications/Examples of results
- IoT-related devices - Wearable-related devices - Server cards - Small sensing modules - Small wireless modules : * In providing products, Kyoden also implements improvement proposals aimed at ensuring reliability.
