Printed Circuit Board Manufacturing - Build-Up Boards

We achieve miniaturization, slimness, and high functionality of electronic devices with Kyoden's build-up substrates!

Compatible with ultra-thin build-up layer filled vias. Achieves equivalent filling properties even with build-up layers of different thicknesses. Supports thin plate formation and substrate property requirements with a highly flexible layer configuration. Compatible with 5-layer builds, full stack, and any layer. Kyoden's short delivery times also apply to build-up processes! We can deliver 1-2-1 (4-layer board) in as little as 2 days. 【Features】 ● Smaller substrate size ● Strong against noise ● Capable of carrying large currents ● High design flexibility *For more details, please download the PDF or contact us!

[Special Site] Build-Up Substrate Manufacturing Service

basic information

The build-up method is a technique for manufacturing multilayer printed circuit boards by stacking layers, performing laser drilling, and forming wiring and vias repeatedly for each layer. By using build-up boards, there are several advantages: ● Smaller board size In through-hole boards, it is necessary to create TH (holes that serve as electrical pathways) to connect the layers, which increases the board area due to the holes. In build-up boards, there are no through holes on the surface layer, allowing for a larger component placement area. ● Strong against noise Build-up boards are not only smaller, but their structure also results in thinner interlayer thickness. Therefore, they actually have strong noise resistance characteristics. ● Capable of carrying large currents For devices that use large currents, build-up boards may be more suitable. One reason is that they only place the minimum necessary vias, allowing for more copper foil to be used. ● High design flexibility The freedom of pattern wiring is high, enabling high-density component placement and wiring that was difficult with through-hole boards.