High-speed thick copper plating method for high thermal conductivity high-frequency substrate development.
Challenges related to mass production that were previously unattainable, substrate reliability, and thin plate compatibility have also been cleared.
"Kyoden's Latest Technology: High-Speed Thick Copper Plating Method" This new technology has enabled the development of high heat dissipation, high-frequency substrates. 【Features】 ♢ Overcomes challenges in mass production, substrate reliability, and thin plate compatibility that were previously unattainable ♢ Technology that can also be used for build-up substrates ♢ Compatible with 5G/6G and power semiconductor components ◎ *For more details, please refer to the related links or feel free to contact us.
basic information
For more details, please refer to the related links or feel free to contact us.
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Applications/Examples of results
Compatible with thin substrates of 0.4mm or less, which are difficult to handle with copper inlays! Various substrates such as power component boards and power module boards that require high heat dissipation.
