Introduction of high heat-resistant CFRP using phenolic resin.

三菱ケミカルコンポジットパーツ本部　Asia事業部

The demand for lightweight materials is increasing in mobility applications such as aircraft and automobiles, as well as in industrial machinery applications that require responses to the sophistication and complexity of manufacturing processes along with efficiency improvements. The use of CFRP, which combines lightness and strength, is expected to advance further in the future. Mitsubishi Chemical has developed CFRP with high heat resistance that maintains its properties even at 300°C by using phenolic resin as the base resin. This CFRP, which uses phenolic resin, not only possesses the high thermal conductivity, high rigidity, and lightweight characteristics of CFRP based on epoxy resin but also offers high heat resistance, enabling solutions to customer challenges that have been difficult to address until now. *For more details, please refer to related products and catalogs or feel free to contact us.