三菱ケミカル 工業・メディカルフィルムズセールスグループ Official site

Notice of participation in the 39th Nepcon Japan Electronics Development and Implementation Exhibition (26th Electronic Components and Materials EXPO) for "Metal and Resin Film Laminates Alset."

三菱ケミカル 工業・メディカルフィルムズセールスグループ

We will be exhibiting at the "39th NEPCON Japan Electronics Development and Manufacturing Expo (26th Electronic Components and Materials EXPO)" to be held at Tokyo Big Sight from January 22 (Wednesday) to January 24 (Friday), 2025. Please stop by our booth at East Hall 3, E21-2. At the exhibition, we will introduce "Alset," a metal and resin film laminated material. Alset is an ideal material for next-generation laminated busbars and flexible busbars. It enables high current and high frequency busbars suitable for electric vehicles while also allowing for weight reduction. Additionally, its flexibility helps eliminate cracking caused by vibrations in vehicles. Event Name: 39th NEPCON Japan Electronics Development and Manufacturing Expo (26th Electronic Components and Materials EXPO) Dates: January 22 (Wednesday) to January 24 (Friday), 2025 Venue: Tokyo Big Sight, East Hall 3, E21-2 Official Website: https://www.nepconjapan.jp/tokyo/ja-jp.html We sincerely look forward to your visit.