Ultra-Low Dielectric Film BeLight

Ultra-Low Dielectric Film BeLight
We would like to introduce our "ultra-low dielectric film."
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Ultra-Low Dielectric Film "BeLight(TM)"
Compatible with high-frequency communication! A film with strong adhesion to copper foil and low water absorption.
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Thermoplastic ultra-low transmission loss film 'BeLight' <low dielectric properties>
Super low dielectric with a dielectric constant of 2.2! Using lower-cost materials compared to current low dielectric materials.
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Thermoplastic ultra-low transmission loss film "BeLight" <Adhesion with copper foil>
The adhesion strength of the copper foil is Max. > 20N/cm! Due to excellent workability, process costs can be reduced.
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Thermoplastic ultra-low transmission loss film 'BeLight' <low water absorption>
Low water absorption (<0.1%)! Applicable for use as cable insulation and transparent antenna substrates.
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Ultra-low transmission loss film "BeLight" <Fluororesin-free>
High-frequency characteristics of fluororesin level! Usable as both an adhesive and a substrate for FFC.
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BeLight usage example: Flat cable insulation material
Can also be used as adhesives or substrates! Introduction to flat cable materials.
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BeLight Use Case: Transparent Antenna
Good transparency and weather resistance! No discoloration or deterioration of low dielectric properties due to UV exposure.
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