Printed Circuit Board Strength Analysis Software for the Semiconductor Manufacturing Equipment Industry

Streamlining the strength analysis of printed circuit boards for power electronics products!

Power electronics products mounted on semiconductor manufacturing equipment are becoming more high-performance and compact, while the risk of damage to printed circuit boards due to vibration and heat is increasing. Traditional design methods have made it difficult to adequately assess these risks, leading to longer development times and increased costs. 'FEMFAT MELCOM' is a strength analysis software for printed circuit boards developed to address these challenges. 【Usage Scenarios】 - Development of power electronics products mounted on semiconductor manufacturing equipment - Strength analysis of printed circuit boards - Evaluation of damage risks due to vibration and heat - Reduction of development time - Cost reduction 【Benefits of Implementation】 By implementing 'FEMFAT MELCOM', the strength analysis of printed circuit boards for power electronics products can be streamlined, achieving shorter development times and cost reductions. Additionally, pre-evaluation through simulation contributes to improved product reliability.

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basic information

【Features】 - Predicting cracks in solder joints on printed circuit board assemblies (PCBA) due to vibrations from power electronics products. - Predicting the cracking of multilayer ceramic capacitors (MLCC) during the process of attaching the PCBA to the power module. - Predicting cracks due to thermal fatigue in relation to the temperature load on the PCBA. - Automating the creation of PCBA models. - Creating a database of detailed models of solder joints. Our Strengths Magna Powertrain & ECS is a member of the Magna Group, providing globally recognized engineering services. Leveraging years of experience and know-how, we offer optimal solutions tailored to our customers' needs.