The noteworthy sealing technology for electrical components, "Hot Melt Molding." At Matsumoto Processing Lab, you can observe the actual sealing process. We hope you will consider it.
松本加工
"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding, which is gaining attention for waterproof sealing of electronic components, uses thermoplastic adhesives in low-pressure insert molding to achieve environmental protection such as waterproofing and dustproofing for electronic components like mounted circuit boards. Compared to traditional two-component potting and conformal coating, sealing is completed in an extremely short time, leading to an expansion in the adoption of this sealing technology.
Now, at the Matsumoto Processing Lab, nine hot melt molding machines are installed, and you can observe the process of hot melt sealing electronic components. If you are interested in a tour, please feel free to contact us.
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