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[For Waterproofing Circuit Boards!] Technical Document: Introduction to Hot Melt Molding

Hot melt molding, which is gaining attention as a waterproof sealing method alternative to potting. Sealing is completed in just a few dozen seconds per cycle. Contributes to cost reduction!

Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! Hot melt molding is gaining attention as a waterproof technology for circuit boards. What is hot melt molding? How is it different from potting? What is the process for implementation? We will answer these questions. In recent years, hot melt molding has been increasingly adopted in various fields such as automotive electronic components, mobile devices, home electronics, and IoT devices as a waterproofing method to replace potting, contributing to improved productivity and cost reduction.

Matsumoto Processing Official Website

basic information

What is hot melt molding? Advantages of hot melt molding How to get started with hot melt molding? We will answer such questions. ■Please download the catalog from below. Matsumoto Processing will respond quickly to your needs by proposing the optimal hot melt solution, modeling sealing shapes, designing and manufacturing molds, and creating prototypes based on your product reliability requirements. For customers wishing to implement hot melt sealing processes in-house, we provide comprehensive support including the manufacturing and sales of molding machines and molds, development of molding parameters, process startup assistance, and hot melt supply. For customers who wish to outsource hot melt sealing, we offer contract molding services at our factory.

Price range

Delivery Time

Model number/Brand name

Low Pressure Molding, Hot Melt Molding, Waterproof and Dustproof, Encapsulation Molding

Applications/Examples of results

- Waterproof sealing of automotive parts (electrical components) - Waterproof sealing of mobile device parts - Waterproof sealing of home electronics device parts - Waterproof sealing of IoT devices (sensors, etc.) and more In particular, there are many cases where customers who traditionally used two-component potting have adopted hot melt molding for cost reduction and process improvement. By switching to hot melt molding, it is possible to achieve cost reduction and miniaturization.

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