Hot melt molding adhesive

Hot melt molding adhesive
Adhesives modified specifically for hot melt molding. Our company handles a wide range of adhesives, including polyamide-based, polyolefin-based, and moisture-curing polyurethane-based adhesives, and we will propose the most suitable materials after discussing with our customers. Additionally, we provide robust technical support for our customers, including design support using 3D CAD and CAE, the design and production of simple molds for prototypes, and prototype evaluation in our prototype lab.
1~7 item / All 7 items
-
【Waterproof Sealing of Circuit Boards】Hot Melt Adhesive for Molding ■■Matsumoto Processing■■
"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.
last updated
-
[For Waterproofing Circuit Boards!] Technical Document: Introduction to Hot Melt Molding
Hot melt molding, which is gaining attention as a waterproof sealing method alternative to potting. Sealing is completed in just a few dozen seconds per cycle. Contributes to cost reduction!
last updated
-
Hot melt molding for waterproofing, dustproofing, and cost reduction of circuit boards.
"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.
last updated
-
Hot melt contract molding for waterproofing of substrates and components ■ Matsumoto Processing ■
Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! We offer contract processing for hot melt molding sealing.
last updated
-
Waterproof sealing of the substrate: Achieving cost reduction as an alternative to two-component potting.
"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." A sealing method for electronic components that replaces potting = hot melt molding.
last updated
-
For waterproofing and dustproofing of electrical components. Hot melt molding.
Free collection of case studies and technical materials packed with tips and know-how for improving processes related to waterproofing, dustproofing, and insulation of implementation substrates!
last updated
-
Waterproof insulation for substrates and electrical components. Sample gift of "hot melt molding."
"Hot melt molding," which is increasingly being adopted for waterproofing and insulating sealing of substrates and electronic components. We are offering a sample of an LED substrate sealed with hot melt molding for free.
last updated