【Waterproof Sealing of Circuit Boards】Hot Melt Adhesive for Molding ■■Matsumoto Processing■■
"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electrical components.
▼VA: Switching of two-component potting agents ▼ ▼Waterproofing of substrates ▼ ▼Water sealing of terminals and connectors ▼ ▼Vibration damping of module components ▼ The hot melt adhesives we handle have a wide environmental temperature range of -40 to 140°C and are particularly well-established for sealing applications in automotive components. Additionally, they are sustainable products made primarily from natural fatty acids derived from grains. We will propose the most suitable hot melt adhesive based on your usage conditions. ◆ Our company consistently responds with in-house technology for selecting the optimal materials for your product specifications, designing molded products, conducting CAE analysis, and prototyping. Please feel free to contact us.
basic information
Our company consistently provides technical support under the customer-first philosophy, from product shape design and prototype mold design and manufacturing to prototyping in our lab, evaluation of prototypes, proposals for mass production processes, design and manufacturing of molding equipment, and support for mass production startup. Our in-house sales and technical staff, equipped with extensive experience in hundreds of cases and utilizing technologies such as 3D-CAD design, flow analysis, residual stress analysis, and strength analysis, will propose the most suitable materials for our customers. Additionally, using a specially developed flow analysis environment, we address a series of processes towards product commercialization, including optimization proposals for molding shapes, manufacturing of prototype molds, and prototyping evaluations in our lab.
Price range
Delivery Time
Model number/Brand name
Low Pressure Molding, Hot Melt Molding, Waterproof and Dustproof, Encapsulation Molding
Applications/Examples of results
Automotive parts: Numerous items including dashboard harnesses, circuit boards, switches, coil antennas, camera modules, etc. Home appliances: Numerous items including circuit boards, sensors, etc. Mobile devices: Numerous items including camera modules, circuit boards, harness assemblies, batteries, etc.
Detailed information
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Examples of waterproof sealing for agricultural machinery substrates Left is before sealing / Right is after sealing (the black part is the hot melt molded section)
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Example of waterproof sealing for motor stators The amber-colored part on the product's outer circumference is the hot melt molded section.
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Example of encapsulation for industrial equipment circuit boards Left is before encapsulation / Right is after encapsulation (the black part is the hot melt molding section)
Related Videos
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News about this product（32）
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We have uploaded a video introduction page about the waterproof sealing method for electrical components, "Hot Melt Molding." Please take a look.
We will introduce the waterproof sealing method for electrical components, "Hot Melt Molding," in a video. - Video introduction of the sealing process using various molding machines - Comparison between Hot Melt Molding and Potting - Video introduction of case studies using Hot Melt Molding and more. Please take a look!
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Hot melt molding for waterproofing, dustproofing, and miniaturization of M2M/IOT sensors.
Our company specializes in hot melt technology, specifically "hot melt molding," which is used for low-pressure molding to seal electronic devices. In recent years, we have received a significant number of inquiries for M2M/IOT applications, particularly for sensors installed outdoors and those used in harsh environments, aimed at waterproofing, dustproofing, and insulation. Examples of inquiries: - Sensors for agricultural applications (soil sensors, livestock management sensors) - Sensors for building management - Sensors for monitoring the operational status of outdoor equipment (such as outdoor units) - Drones, etc. Why is hot melt molding gaining attention? - It can mold at low pressure, allowing for sealing even delicate sensors. - Extensive waterproofing and dustproofing experience cultivated through automotive components. - The hot melt used is flame-retardant and UL94 V-0 certified. - The raw materials are derived from natural components (non-petroleum-based) and are environmentally friendly. Matsumoto Processing also accommodates small-batch sealing through a contract production system. Customers with themes related to waterproofing and dustproofing for sensors are encouraged to inquire.
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Hot Melt Molding for Waterproofing and Dustproofing, as well as Miniaturization of M2M/IOT Sensors
Our company specializes in hot melt technology, specifically "hot melt molding," which is used for low-pressure molding to seal electronic devices. In recent years, we have received numerous inquiries for M2M/IOT applications, particularly for sensors installed outdoors and those used in harsh environments, aimed at waterproofing, dustproofing, and insulation. Examples of inquiries: - Sensors for agricultural applications (soil sensors, livestock management sensors) - Sensors for building management - Sensors for monitoring the operational status of outdoor equipment (such as outdoor units) - Drones, etc. Why is hot melt molding gaining attention? - It can mold at low pressure, allowing for sealing of delicate sensors. - Extensive waterproof and dustproof track record developed through automotive components. - The hot melt used is flame-retardant and UL94 V-0 certified. - Raw materials are derived from natural components (non-petroleum-based) and are environmentally friendly. Matsumoto Processing also accommodates small-volume sealing through a contract production system. Customers with themes related to waterproofing and dustproofing for sensors are encouraged to inquire.
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[New Product Announcement] Thermal Conductive Hot Melt TC50
We have received numerous requests for thermal conductive hot melt. We are pleased to announce a hot melt that achieves excellent thermal conductivity with a thermal conductivity rate of 0.65 W/m·K (300% compared to conventional products). It meets the requirements for both encapsulation and heat dissipation for control boards in drive systems and substrates for LED lighting. We will be distributing sample pieces at AUTOMOTIVE WORLD 2018. Date: January 17-19, 2018 Venue: Tokyo Big Sight, Booth No. E65-100 We look forward to your visit.
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Differences between potting method and hot melt molding method for waterproofing circuit boards. ■■Matsumoto Processing■■
From January 17 (Wednesday) to 19 (Friday), 2018, at Tokyo Big Sight, we will be showcasing the new hot melt molding machine MK520. We invite you to visit us! Our booth number is [E65-100]. If you would like a free invitation ticket, please feel free to contact us. There are many examples of achieving value analysis (VA) by switching from a two-component potting process to hot melt molding. We have compiled these examples into a document from a process perspective. Please download it and check it out.
