For waterproofing and dustproofing of electrical components. Hot melt molding.
Free collection of case studies and technical materials packed with tips and know-how for improving processes related to waterproofing, dustproofing, and insulation of implementation substrates!
"Hot Melt Molding" is a groundbreaking new technology for waterproofing substrates and electronic components that significantly reduces processing time compared to traditional methods. The case study collection includes numerous examples where switching from potting to hot melt molding has led to shortened processing times and cost reductions. The technical documentation provides know-how on hot melt molding and waterproofing of substrates and electronic components, including comparisons with traditional methods and their advantages. [Contents] ■ Hot Melt Molding Case Study Collection (16 pages, 15 cases) ■ Automotive Parts Application Case Study Collection (5 pages, 6 cases) ■ Mobile Device Application Case Study Collection (3 pages, 2 cases) ■ Hot Melt Molding Technical Documentation (10 pages) ■ [Technical Documentation] Achieving VA through Switching from Potting (7 pages, 3 cases) * Please view the PDF of the "Hot Melt Molding Case Study Collection & Technical Documentation" from the download section.
basic information
Our company provides comprehensive support from the initial technical discussions and prototype production and evaluation, to the examination of optimal processes for mass production, equipment proposals, design and manufacturing of dedicated machines (automated systems), supply of resin materials, and line support. Additionally, for customers who find it difficult to introduce equipment, we offer contract manufacturing services at our factory. We have various molding machines and displays of adopted products available at our prototype lab in Fuji City, Shizuoka Prefecture. Please feel free to visit, even if it's just for a tour.
Price range
Delivery Time
Model number/Brand name
Low Pressure Molding, Hot Melt Molding, Waterproof and Dustproof, Encapsulation Molding
Applications/Examples of results
For more details, please refer to the catalog or feel free to contact us.
Detailed information
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Case Studies of Hot Melt Molding Adoption (Total 16 pages, 15 cases) Includes numerous examples where switching from potting to hot melt molding has reduced processing time and led to cost savings.
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Automotive Parts Application Case Studies (Total of 5 pages, 6 cases) Examples applied in the automotive industry and automotive parts industry are included.
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Mobile Device Application Case Studies (Total of 3 pages, 2 cases) Examples of applications in the mobile device manufacturing industry are included.
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Hot Melt Molding Technical Documentation (Total of 10 Pages) Includes know-how on hot melt molding and waterproofing of substrates and electronic components, along with comparisons and advantages over conventional methods.
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[Technical Document] Achieving VA through Switching from Potting A technical document featuring know-how on achieving VA by switching from potting to hot melt molding, explained clearly with three case studies.
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News about this product（4）
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Hot melt molding for waterproofing, dustproofing, and miniaturization of M2M/IOT sensors.
Our company specializes in hot melt technology, specifically "hot melt molding," which is used for low-pressure molding to seal electronic devices. In recent years, we have received a significant number of inquiries for M2M/IOT applications, particularly for sensors installed outdoors and those used in harsh environments, aimed at waterproofing, dustproofing, and insulation. Examples of inquiries: - Sensors for agricultural applications (soil sensors, livestock management sensors) - Sensors for building management - Sensors for monitoring the operational status of outdoor equipment (such as outdoor units) - Drones, etc. Why is hot melt molding gaining attention? - It can mold at low pressure, allowing for sealing even delicate sensors. - Extensive waterproofing and dustproofing experience cultivated through automotive components. - The hot melt used is flame-retardant and UL94 V-0 certified. - The raw materials are derived from natural components (non-petroleum-based) and are environmentally friendly. Matsumoto Processing also accommodates small-batch sealing through a contract production system. Customers with themes related to waterproofing and dustproofing for sensors are encouraged to inquire.
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Hot Melt Molding for Waterproofing and Dustproofing, as well as Miniaturization of M2M/IOT Sensors
Our company specializes in hot melt technology, specifically "hot melt molding," which is used for low-pressure molding to seal electronic devices. In recent years, we have received numerous inquiries for M2M/IOT applications, particularly for sensors installed outdoors and those used in harsh environments, aimed at waterproofing, dustproofing, and insulation. Examples of inquiries: - Sensors for agricultural applications (soil sensors, livestock management sensors) - Sensors for building management - Sensors for monitoring the operational status of outdoor equipment (such as outdoor units) - Drones, etc. Why is hot melt molding gaining attention? - It can mold at low pressure, allowing for sealing of delicate sensors. - Extensive waterproof and dustproof track record developed through automotive components. - The hot melt used is flame-retardant and UL94 V-0 certified. - Raw materials are derived from natural components (non-petroleum-based) and are environmentally friendly. Matsumoto Processing also accommodates small-volume sealing through a contract production system. Customers with themes related to waterproofing and dustproofing for sensors are encouraged to inquire.
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[New Product Announcement] Thermal Conductive Hot Melt TC50
We have received numerous requests for thermal conductive hot melt. We are pleased to announce a hot melt that achieves excellent thermal conductivity with a thermal conductivity rate of 0.65 W/m·K (300% compared to conventional products). It meets the requirements for both encapsulation and heat dissipation for control boards in drive systems and substrates for LED lighting. We will be distributing sample pieces at AUTOMOTIVE WORLD 2018. Date: January 17-19, 2018 Venue: Tokyo Big Sight, Booth No. E65-100 We look forward to your visit.
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We will be exhibiting at Automotive World 2018.
We will be exhibiting at Automotive World 2018 from January 17 (Wednesday) to January 19 (Friday) (Our booth number is E65-100). On that day, we will be demonstrating our molding machines MK520 and MK600. We sincerely look forward to your visit.
