Waterproof sealing of the substrate: Achieving cost reduction as an alternative to two-component potting.
"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." A sealing method for electronic components that replaces potting = hot melt molding.
By replacing potting, we achieve cost reduction and miniaturization. Hot melt molding has the following advantages, and the transition from two-component potting is progressing. - Extremely short cycle time In hot melt molding, sealing is completed in just a few seconds. - Possibility of miniaturization and lightweight design Since it allows for direct insert molding of electronic components, there is no need for a case, and the high degree of freedom in shape enables miniaturization and lightweight design. - Sustainability The PA-based hot melts we handle are primarily made from natural vegetable oils, offering excellent environmental benefits. We have compiled materials on how potting and hot melt molding differ. Please download the materials. *For the "cost reduction" materials, please view the PDF data from the download.
basic information
Our company provides comprehensive technical support under the customer-first philosophy, from product shape design, prototype mold design and manufacturing, prototype evaluation, process proposals during mass production, to molding equipment design and manufacturing, and mass production startup support. Our in-house technical sales staff utilize their extensive experience, which spans hundreds of cases, along with technologies such as 3D-CAD design, custom-developed flow analysis, and residual stress analysis to make optimal proposals.
Price range
Delivery Time
Model number/Brand name
Low Pressure Molding, Hot Melt Molding, Waterproof and Dustproof, Encapsulation Molding
Applications/Examples of results
- Automotive seat sensor - Automotive belt buckle sensor - Automotive power window switch - Automotive control board - Sealing of motor stator - Sealing of antenna coil - Waterproof sealing of IoT devices etc.....
Detailed information
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Example of waterproof sealing for agricultural machinery substrates. The left photo shows before sealing, and the right photo shows after sealing (the black part is the hot melt molded section).
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Example of encapsulation for industrial equipment circuit boards. The left photo shows before encapsulation, and the right photo shows after encapsulation (the black part is the hot melt molded section).
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Example of waterproof sealing for motor stators. The amber-colored part covering the circuit board and the area around the coil in the photo is the hot melt molding section.
Related Videos
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News about this product（10）
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【Sample Giveaway】We are offering free samples of products that apply hot melt molding, a waterproof sealing method for electrical components that replaces potting, to LED substrates.
"Free Sample Presentation Campaign" This time, we are offering free samples of our LED-equipped boards that have been completely sealed using hot melt molding to customers who request them. Please feel free to take a look at the actual product. "What is Hot Melt Molding?" It is a groundbreaking sealing method that provides excellent waterproofing, dustproofing, and insulation by injecting thermoplastic adhesive around electronic components. Since it solidifies within seconds in the mold, sealing is completed in a shorter time compared to traditional two-component potting and BMC molding. Additionally, the hot melt we handle is primarily made from natural fatty acids derived from grains, making it highly sustainable. Customers who wish to receive a sample, please do not hesitate to contact us.
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We achieve cost reduction as an alternative to potting. We have summarized the waterproof sealing process using the notable electrical component sealing technology "hot melt molding" in a one-minute video. Please take a look.
"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding, which is gaining attention for waterproof sealing of electronic components. This technology achieves environmental protection such as waterproofing and dustproofing by low-pressure insert molding of thermoplastic adhesives on electronic components like mounted circuit boards. Compared to traditional two-component potting and conformal coating, sealing is completed in an extremely short time, leading to an expansion in its adoption as a sealing technology. We have succinctly summarized the sealing process in a one-minute video. You can watch it through the related links below. Please take a look!
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"Complete sealing of electrical components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding, which is gaining attention for waterproof sealing of electrical components, introduces a hot melt with excellent optical properties that were not present in conventional products.
Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation! We have received numerous inquiries and requests regarding hot melt molding for waterproof sealing of LED lighting fixtures, electronic components, optical sensors, and more. However, conventional hot melts had a strong yellow tint and issues with light transmittance. The newly introduced hot melt has extremely high transparency and excellent UV resistance, making it suitable for applications such as lighting components and optical sensors. If you would like to see samples or need detailed information, please feel free to contact us.
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We have uploaded a video introduction page about the waterproof sealing method for electrical components, "Hot Melt Molding." Please take a look.
We will introduce the waterproof sealing method for electrical components, "Hot Melt Molding," in a video. - Video introduction of the sealing process using various molding machines - Comparison between Hot Melt Molding and Potting - Video introduction of case studies using Hot Melt Molding and more. Please take a look!
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Hot Melt Simple Molding System MK100 for Waterproofing Circuit Boards and Electrical Components - Matsumoto Processing
Today, we have released the latest model of our molding machine. ★ By minimizing functions, we have achieved a low price of 1.8 million yen. ★ The clamping stage can be easily installed on a tabletop. ★ It is ideal for sealing small items such as switches and sensors, as well as for prototyping. Despite the low price, it allows for: - Control of discharge speed - Control of discharge pressure - Control of discharge time and cooling time And it is equipped with a clamping mechanism (2.5 kN). Please feel free to download the materials.
