For waterproofing, dustproofing, and insulation of electrical components. The spotlight is on the sealing technology "Hot Melt Molding." At Matsumoto Processing Lab, you can observe the actual sealing process. Please consider it.
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"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding, which is gaining attention for waterproof sealing of electronic components, involves low-pressure insert molding of thermoplastic adhesives to achieve environmental protection such as waterproofing and dustproofing for electronic components like mounted circuit boards. Compared to traditional two-component potting and conformal coating, sealing is completed in an extremely short time, leading to an expansion in the adoption of this sealing technology.
Now, at the Matsumoto Processing Lab, nine hot melt molding machines are installed, and it is possible to observe the process of hot melt sealing electronic components. Customers interested in observing are encouraged to inquire.
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