[For Waterproofing Circuit Boards!] Hot Melt Molding Case Study Vol. 4 - Assembled Circuit Boards - ■■Matsumoto Processing■■

松本加工
Hot melt molding has a proven track record in waterproof applications for implementation boards. The ability to produce in a shorter time compared to traditional urethane potting methods and the potential for miniaturization and weight reduction are key factors in adopting this method. We hope this will be useful for your product development and cost reduction considerations. Please refer to the attached materials for more details.
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