Hot Melt Molding Case Study Vol. 13 IC Tag ■■Matsumoto Processing■■

松本加工
Hot melt molding is optimal for encapsulating fine wire coil antennas like IC tags. The material has a melting viscosity of 1.9 Pa·s, allowing it to be molded at an extremely low pressure of around 0.5 MPa, which prevents damage to delicate components.
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