Hot Melt Molding Case Study: Insulation and Protection of FPC Implementation - Matsumoto Processing

松本加工
A certain mobile device manufacturer uses hot melt molding for the protective insulation of ICs mounted on FPC. In addition to protecting and insulating the mounting area, it also serves as a countermeasure against cracking at the joint between the FPC and the ultra-thin glass-epoxy substrate. Please check the attached download for more details.
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