松本加工 Official site

  • PRODUCT

Achieve cost reduction by switching from 2-component potting for waterproof sealing of circuit boards! ■■ Matsumoto Processing ■■

松本加工

松本加工

[Reduction of resin amount, shortening of cycle time, reduction of number of parts, etc.] Many customers have achieved a reduction in manufacturing costs by switching from traditional two-component potting to hot melt molding. Therefore, we have compiled a document outlining the differences between potting and hot melt molding. Please check the attached download for details.

Related Links

Our Company Website
Case studies, list of materials, list of equipment, etc.

Related catalog

"Complete sealing of electrical components in just a few dozen seconds. Waterproof, dustproof, and insulated." Case studies on hot melt molding (automotive parts) ■Matsumoto Processing■

TECHNICAL

"Complete sealing of electronic components in just a few dozen seconds. Waterproof, dustproof, and insulated." Case studies on hot melt molding. ■Matsumoto Processing■

TECHNICAL

Low-cost & High-tactile molding machine MK10 ■Matsumoto Processing■

PRODUCT