Achieve cost reduction by switching from 2-component potting for waterproof sealing of circuit boards! ■■ Matsumoto Processing ■■

松本加工
[Reduction of resin amount, shortening of cycle time, reduction of number of parts, etc.] Many customers have achieved a reduction in manufacturing costs by switching from traditional two-component potting to hot melt molding. Therefore, we have compiled a document outlining the differences between potting and hot melt molding. Please check the attached download for details.
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