Waterproofing and Cost Reduction for Circuit Boards: 'Hot Melt Molding' for Customers Struggling with Two-Part Potting - Matsumoto Processing

松本加工
For customers using two-component potting for waterproof protection of substrates and sensors! Are you facing issues such as long curing times, batch processing in outlines, or poor yield? Why can a significant value-added (VA) be achieved by switching to hot melt molding? We will introduce this in the attached document. Please feel free to download it. Matsumoto Processing has realized numerous VAs by introducing the hot melt molding method to customers struggling with the potting process. Matsumoto Processing consistently supports this method from the initial design of molded products, selection of optimal materials, prototype evaluation, to the design and production of mass production equipment and contracting of mass production work. If you are interested, please do not hesitate to contact us.
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