Matsumoto Processing's heat dissipation solution - thermal conductive filler [GAPFILLER]
松本加工
In recent years, the importance of thermal management has been increasing to efficiently dissipate heat in components that are miniaturized or require high current. Therefore, Matsumoto Processing is proposing a two-component curing thermal conductive filler. This material can be automatically applied at room temperature using a dispenser, can be easily compressed to any desired thickness, and flexibly conforms to the unevenness of components. It reacts and cures within a few hours after application, and after curing, it becomes a solid material with flexibility, eliminating concerns about pump-out during long-term use. This product is expanding its applications in filling gaps between heat-generating components and heat sinks, as well as between heat-generating substrates and aluminum cases. Please feel free to contact us.
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