Thermal Conductive Filler【GAPFILLER】
Two-component mixed thermal conductive polymer. It cures when left at room temperature. Due to its liquid state, it has a high degree of shape freedom and can be applied using automated machines.
【Features】 - Being in liquid form, it shows high wettability on the substrate surface, reducing thermal resistance. - There is great freedom in shape and thickness, making design easier. - Automatic application using a dispenser is possible. - It cures at room temperature, so there is no aging reduction like with thermal conductive grease.
basic information
This product provides a high-efficiency thermal interface without air gaps by filling the space between the heat-generating components and the heat-dissipating components. It is a two-component mixed type filler that can be applied with a dispenser at room temperature and becomes a low-elasticity thermally conductive polymer after curing.
Price range
Delivery Time
Model number/Brand name
GAPFILLER Heat insulating material TIM Thermal conductivity Cooling
Applications/Examples of results
- Heat conduction between the heat-generating components of the implementation board and the heat sink - Heat dissipation of the battery
News about this product（2）
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Matsumoto Processing's heat dissipation solution - thermal conductive filler [GAPFILLER]
In recent years, the importance of thermal management has been increasing to efficiently dissipate heat in components that are miniaturized or require high current. Therefore, Matsumoto Processing is proposing a two-component curing thermal conductive filler. This material can be automatically applied at room temperature using a dispenser, can be easily compressed to any desired thickness, and flexibly conforms to the unevenness of components. It reacts and cures within a few hours after application, and after curing, it becomes a solid material with flexibility, eliminating concerns about pump-out during long-term use. This product is expanding its applications in filling gaps between heat-generating components and heat sinks, as well as between heat-generating substrates and aluminum cases. Please feel free to contact us.
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The product page for the thermal conductive filler 【GAPFILLER】 has been updated.
In recent years, especially in E-Mobility such as BEV/HEV and 5G communication devices, the demand for efficient thermal management, including heat dissipation of electronic components and batteries, has been increasing. Our company offers gap fillers to achieve high-efficiency heat exchange between heat-generating components and heat-dissipating components. Please take a look.
