Thermal Conductive Filler【GAPFILLER】
Two-component mixed thermal conductive polymer. It cures when left at room temperature. Due to its liquid state, it has a high degree of shape freedom and can be applied using automated machines.
【Features】 - Being in liquid form, it shows high wettability on the substrate surface, reducing thermal resistance. - There is great freedom in shape and thickness, making design easier. - Automatic application using a dispenser is possible. - It cures at room temperature, so there is no aging reduction like with thermal conductive grease.
basic information
This product provides a high-efficiency thermal interface without air gaps by filling the space between the heat-generating components and the heat-dissipating components. It is a two-component mixed type filler that can be applied with a dispenser at room temperature and becomes a low-elasticity thermally conductive polymer after curing.
Price range
Delivery Time
Model number/Brand name
GAPFILLER Heat insulating material TIM Thermal conductivity Cooling
Applications/Examples of results
- Heat conduction between the heat-generating components of the implementation board and the heat sink - Heat dissipation of the battery
News about this product（2）
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Matsumoto Processing's heat dissipation solution - thermal conductive filler [GAPFILLER]
In recent years, the importance of thermal management has been increasing to efficiently dissipate heat in components that are miniaturized or require high current. Therefore, Matsumoto Processing is proposing a two-component curing thermal conductive filler. This material can be automatically applied at room temperature using a dispenser, can be easily compressed to any desired thickness, and flexibly conforms to the unevenness of components. It reacts and cures within a few hours after application, and after curing, it becomes a solid material with flexibility, eliminating concerns about pump-out during long-term use. This product is expanding its applications in filling gaps between heat-generating components and heat sinks, as well as between heat-generating substrates and aluminum cases. Please feel free to contact us.
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The product page for the thermal conductive filler 【GAPFILLER】 has been updated.
In recent years, especially in E-Mobility such as BEV/HEV and 5G communication devices, the demand for efficient thermal management, including heat dissipation of electronic components and batteries, has been increasing. Our company offers gap fillers to achieve high-efficiency heat exchange between heat-generating components and heat-dissipating components. Please take a look.
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Distributors
Our company provides comprehensive support for the introduction of hot melt molding methods, from initial technical discussions and appropriate hot melt selection to prototype production and evaluation, optimal process considerations for mass production, proposals for optimal equipment or the design and manufacturing of dedicated machines (automated systems), hot melt supply and line support. For customers for whom equipment installation poses a barrier to adopting this method, we even offer production contracting at our facility, ensuring support from "start to finish." **Benefits of Hot Melt Molding** - Improved production efficiency and cost reduction through alternative methods to potting - Greater design flexibility due to mold forming, enabling miniaturization and lightweighting of components - Use of sustainable raw materials derived from natural fatty acids We have various molding machines and displays of adopted products available at our prototype lab in Fuji City, Shizuoka Prefecture. Please feel free to visit, even just for a tour.