Hot Melt Molding Case Study: "Waterproof Sealing of Printed Circuit Boards"
Waterproof sealing of the implementation substrate. We achieve process improvement and cost reduction by switching from potting.
Hot melt molding is a molding technology that involves injecting solvent-free, one-component thermoplastic hot melt adhesive into a mold under low pressure. This method is widely used for purposes such as dustproofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce a case where waterproof sealing of printed circuit boards has been replaced from urethane potting to hot melt molding. **Benefits of Hot Melt Molding** - It achieves significant process improvements by solidifying in just a few seconds. - Since it does not take time to solidify, it enables inline processing rather than batch processing like potting. - It realizes cost reduction in the process due to the above. - It allows for the creation of freely shaped designs in molds, achieving "compactness and lightweight." *For more details, please refer to the catalog or feel free to contact us.*
basic information
【Conventional Method (Urethane Potting)】 ■ Housing is required ■ Potting material 15.3cc ■ No freedom in shape design ■ Heating curing time: 180 minutes ■ Curing process: Batch production 【New Method (Hot Melt Molding)】 ■ No housing required ■ Hot melt 7.1cc (lightweight) ■ Free shape design ■ Thermoplastic molding: 0.5 minutes ■ Molding process: Single piece flow *For more details, please refer to the catalog or feel free to contact us.
Price range
Delivery Time
Model number/Brand name
Low Pressure Molding, Hot Melt Molding, Waterproof and Dustproof, Encapsulation Molding
Applications/Examples of results
- Waterproof sealing of automotive electrical components - Waterproof sealing of IoT-related components for outdoor installation - Waterproof sealing of small motors and related electrical components
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News about this product（3）
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Hot melt molding for waterproofing, dustproofing, and miniaturization of M2M/IOT sensors.
Our company specializes in hot melt technology, specifically "hot melt molding," which is used for low-pressure molding to seal electronic devices. In recent years, we have received a significant number of inquiries for M2M/IOT applications, particularly for sensors installed outdoors and those used in harsh environments, aimed at waterproofing, dustproofing, and insulation. Examples of inquiries: - Sensors for agricultural applications (soil sensors, livestock management sensors) - Sensors for building management - Sensors for monitoring the operational status of outdoor equipment (such as outdoor units) - Drones, etc. Why is hot melt molding gaining attention? - It can mold at low pressure, allowing for sealing even delicate sensors. - Extensive waterproofing and dustproofing experience cultivated through automotive components. - The hot melt used is flame-retardant and UL94 V-0 certified. - The raw materials are derived from natural components (non-petroleum-based) and are environmentally friendly. Matsumoto Processing also accommodates small-batch sealing through a contract production system. Customers with themes related to waterproofing and dustproofing for sensors are encouraged to inquire.
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Hot Melt Molding for Waterproofing and Dustproofing, as well as Miniaturization of M2M/IOT Sensors
Our company specializes in hot melt technology, specifically "hot melt molding," which is used for low-pressure molding to seal electronic devices. In recent years, we have received numerous inquiries for M2M/IOT applications, particularly for sensors installed outdoors and those used in harsh environments, aimed at waterproofing, dustproofing, and insulation. Examples of inquiries: - Sensors for agricultural applications (soil sensors, livestock management sensors) - Sensors for building management - Sensors for monitoring the operational status of outdoor equipment (such as outdoor units) - Drones, etc. Why is hot melt molding gaining attention? - It can mold at low pressure, allowing for sealing of delicate sensors. - Extensive waterproof and dustproof track record developed through automotive components. - The hot melt used is flame-retardant and UL94 V-0 certified. - Raw materials are derived from natural components (non-petroleum-based) and are environmentally friendly. Matsumoto Processing also accommodates small-volume sealing through a contract production system. Customers with themes related to waterproofing and dustproofing for sensors are encouraged to inquire.
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[New Product Announcement] Thermal Conductive Hot Melt TC50
We have received numerous requests for thermal conductive hot melt. We are pleased to announce a hot melt that achieves excellent thermal conductivity with a thermal conductivity rate of 0.65 W/m·K (300% compared to conventional products). It meets the requirements for both encapsulation and heat dissipation for control boards in drive systems and substrates for LED lighting. We will be distributing sample pieces at AUTOMOTIVE WORLD 2018. Date: January 17-19, 2018 Venue: Tokyo Big Sight, Booth No. E65-100 We look forward to your visit.
