"Free Sample Presentation Campaign" This time, we are offering free samples of our LED-equipped boards that have been completely sealed using hot melt molding to customers who request them. Please feel free to take a look at the actual product. "What is Hot Melt Molding?" It is a groundbreaking sealing method that provides excellent waterproofing, dustproofing, and insulation by injecting thermoplastic adhesive around electronic components. Since it solidifies within seconds in the mold, sealing is completed in a shorter time compared to traditional two-component potting and BMC molding. Additionally, the hot melt we handle is primarily made from natural fatty acids derived from grains, making it highly sustainable. Customers who wish to receive a sample, please do not hesitate to contact us.

The technology "Hot Melt Molding," which is expanding its adoption for waterproofing, dustproofing, and insulation protection of various electrical components, rapidly solidifies thermoplastic hot melt adhesives within molds, completing sealing in a short time of just a few dozen seconds. Compared to traditional urethane potting and epoxy potting, this technology allows for sealing to be completed in an ultra-short time, leading to alternatives aimed at process improvement and cost reduction. Additionally, because it involves mold forming, it offers high freedom of shape, receiving high praise for miniaturization and lightweighting of components. Our company, Matsumoto Processing, has been involved in the protection of many electrical components, including automotive electrical components, as a pioneer of this technology alongside our customers. We can achieve material selection, specification consideration, prototype shape design, mold manufacturing, and prototyping in a short time. Customers interested in this technology are encouraged to feel free to contact us.

"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding, which is gaining attention for waterproof sealing of electronic components. This technology achieves environmental protection such as waterproofing and dustproofing by low-pressure insert molding of thermoplastic adhesives on electronic components like mounted circuit boards. Compared to traditional two-component potting and conformal coating, sealing is completed in an extremely short time, leading to an expansion in its adoption as a sealing technology. We have succinctly summarized the sealing process in a one-minute video. You can watch it through the related links below. Please take a look!

Traditionally, our company has primarily developed gear pump type hot melt molding machines for low-viscosity hot melts. However, in response to customer requests, we have introduced a screw-type medium-pressure hot melt molding device. Features: - Precise measurement using a screw - Extensive molding pressure control from 2MPa to 15MPa - Heating time for hot melt is about a few minutes, making it suitable for materials that are sensitive to decomposition and discoloration due to heat. - By using a horizontal screw, the overall height is kept to 1,940 mm, allowing installation in areas with standard ceiling heights. We have introduced the actual machine in our prototype lab. This enables us to propose and prototype new materials, such as high-viscosity polyester-based hot melts and colorless transparent hot melts that are particularly sensitive to yellowing. The lab also conducts actual molding demonstrations. Please leave hot melt molding to Matsumoto Processing.