Technical Data for Automatic Titration Device: Chloride Ions in Acidic Copper Plating Bath
Automating quality control of the chloride ion concentration in the acidic copper plating bath used for Cu deposition on semiconductor wafers using a potentiometric automatic titration system.
Acid copper plating baths are mainly used for Cu film formation on semiconductor wafers. When a small amount of chloride is present, the film formation rate increases, and anode polarization is suppressed. However, if the concentration becomes too high, the quality of Cu film formation deteriorates, which is undesirable. Therefore, monitoring the concentration of chloride ions is extremely important for efficiently achieving high-quality Cu film formation. Plating bath, electroplating bath.
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By using an automatic titration device with a metronome to measure the chloride ion concentration in the acidic copper plating bath, quality control can be automated.
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Quantification of surfactants by titration
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The booklet is available for free download.
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