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Thermoplastic polyimide resin "Therplim" powder filler application (CFRP toughness enhancer)
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Low dielectric thermoplastic polyimide "Therplim" for high-speed communication equipment (5G)
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Product Information: "Thermoplastic Polyimide Resin - Surprime Sliding Grade TS Series"
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Low dielectric thermoplastic polyimide "Saprime" for high-speed communication devices (5G)
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Application introduction material "Supreme Powder Filler Applications" (CFRP Toughness Enhancer)
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Product Information: "Thermoplastic Polyimide Resin - Suprem Fiber Reinforced Grade"
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Product Information: "Thermoplastic Polyimide Resin, Non-Halogen Flame Retardant Grade TF1401C"
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Base material TZ3300 for polyimide-based test sockets (ceramics-reinforced PI material)
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三菱ガス化学株式会社 グリーン・エネルギー＆ケミカル事業部門
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