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![Exhibiting at Nepcon Japan 2026 [January 21, 2026 (Wed) - January 23, 2026 (Fri)]](https://image.mono.ipros.com/public/news/image/1/324391/IPROS3165023917800797815.png?w=280&h=280)
Exhibiting at Nepcon Japan 2026 [January 21, 2026 (Wed) - January 23, 2026 (Fri)]
Our company, Micro Module Technology Co., Ltd., will be exhibiting at NEPCON JAPAN 2026, one of Asia's largest electronics technology exhibitions, held at Tokyo Big Sight (Koto Ward, Tokyo) from January 21 (Wednesday) to January 23 (Friday). Our booth number is E32-62. NEPCON JAPAN is one of Japan's largest specialized exhibitions that brings together design, implementation, inspection, and manufacturing technologies in the electronics field. It attracts numerous industry professionals each year, serving as a venue for direct information exchange and business discussions about the latest technologies and solutions. At our booth, we will introduce our unique technologies and initiatives, along with examples and materials. We will also be available to discuss inquiries related to product miniaturization, high density, and quality improvement. We warmly invite you to visit our booth when you attend the event. We look forward to the opportunity to speak with you directly.
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Notice of Participation in "Nepcon Japan 2023" from January 25 (Wednesday) to January 27 (Friday), 2023.
Micro Module Technology will be exhibiting at "NEPCON Japan 2023," held at Tokyo Big Sight. This exhibition is a large-scale event with 1,100 companies participating, allowing you to compare and evaluate new electronic components, materials, manufacturing, and inspection equipment from around the world all at once. If you have concerns such as wanting to compare while watching live demonstrations or wanting to introduce new equipment to improve productivity, all of these issues can be resolved at this exhibition. We invite everyone to come and visit us. If you need an invitation, please feel free to let us know.
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Notice of participation in Nepcon Japan Tokyo from January 19 (Wednesday) to January 21 (Friday), 2022.
Our company will be exhibiting at the "Nepcon Japan Electronics Development and Implementation Exhibition" held at Tokyo Big Sight from January 19 (Wednesday) to January 21 (Friday), 2022. This exhibition will showcase world-leading electronic components, materials, mount machines, and inspection equipment that support the multifunctionality and high performance of electronics. We warmly invite electronics, semiconductor and sensor, electronic component, and automotive and electrical equipment manufacturers to visit us. We sincerely look forward to your attendance.
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Notice of participation in Smart Sensing 2021 from October 27 (Wednesday) to 29 (Friday), 2021.
Our company will be exhibiting at Smart Sensing 2021, which will be held at Tokyo Big Sight. Sensors have become essential for many digital devices, starting from industrial fields such as factory automation (FA), especially for IoT. We invite everyone to come and visit us. Please feel free to let us know if you need an invitation.
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We will be exhibiting at the Technical Show Yokohama 2020 from February 5 (Wednesday) to February 7 (Friday).
We will be exhibiting at the 41st Industrial Technology Exhibition "Technical Show Yokohama 2020," which will be held at Pacifico Yokohama from February 5 (Wednesday) to February 7 (Friday), 2020. This exhibition is one of the largest comprehensive trade shows for industrial technology and products in Kanagawa Prefecture. It has established a solid position in the metropolitan area as a comprehensive industrial exhibition covering both hard and soft aspects, including materials, components, research and development, manufacturing, as well as welfare and environmental issues. We look forward to your visit.
Declaration of a module revolution with the latest implementation technology!
We provide one-stop support for the miniaturization and thinning of electronic devices through bare chip direct mounting technology. Micro Module Technology Co., Ltd. specializes in micro-joining technologies for bare chip direct mounting and interconnection between substrates. We pursue manufacturing solutions that enable miniaturization, higher functionality, and improved cost competitiveness of electronic devices. For the downsizing and modularization of printed circuit boards, we offer integrated support covering concept planning, design and development, prototyping, evaluation and analysis, and mass production. By operating our own in-house manufacturing facilities, we realize a one-stop service and provide bare chip direct mounting technologies at more reasonable costs, which were previously difficult to adopt for small-lot production due to cost constraints. Our factory is equipped with cleanroom environments of Class 100 to 1000, enabling the production of high-quality modules and printed circuit boards. If you are considering miniaturization, thinning, or modularization of electronic circuit boards, please feel free to contact us.




