Product Categories
Products/Services（9items）
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Development and prototyping environment for semiconductor packaging - equipment/devices
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Cutting-edge technology that realizes miniaturization and high performance of semiconductors!
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Ultra-compact CMOS camera module "IKURA Series"
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Prototyping and manufacturing of "Small Custom SiC Power Modules"
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Development and manufacturing of semiconductor and sensor packaging & camera modules.
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Contracted Service "Mass Production Manufacturing Service"
news list
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Notice of Participation in "Nepcon Japan 2023" from January 25 (Wednesday) to January 27 (Friday), 2023.
Micro Module Technology will be exhibiting at "NEPCON Japan 2023," held at Tokyo Big Sight. This exhibition is a large-scale event with 1,100 companies participating, allowing you to compare and evaluate new electronic components, materials, manufacturing, and inspection equipment from around the world all at once. If you have concerns such as wanting to compare while watching live demonstrations or wanting to introduce new equipment to improve productivity, all of these issues can be resolved at this exhibition. We invite everyone to come and visit us. If you need an invitation, please feel free to let us know.
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Notice of participation in Nepcon Japan Tokyo from January 19 (Wednesday) to January 21 (Friday), 2022.
Our company will be exhibiting at the "Nepcon Japan Electronics Development and Implementation Exhibition" held at Tokyo Big Sight from January 19 (Wednesday) to January 21 (Friday), 2022. This exhibition will showcase world-leading electronic components, materials, mount machines, and inspection equipment that support the multifunctionality and high performance of electronics. We warmly invite electronics, semiconductor and sensor, electronic component, and automotive and electrical equipment manufacturers to visit us. We sincerely look forward to your attendance.
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Notice of participation in Smart Sensing 2021 from October 27 (Wednesday) to 29 (Friday), 2021.
Our company will be exhibiting at Smart Sensing 2021, which will be held at Tokyo Big Sight. Sensors have become essential for many digital devices, starting from industrial fields such as factory automation (FA), especially for IoT. We invite everyone to come and visit us. Please feel free to let us know if you need an invitation.
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We will be exhibiting at Nepcon Nagoya!
We will be exhibiting at Nepcon Nagoya! Dates: October 21 (Wednesday) - 23 (Friday), 2020 Time: 10:00 AM - 5:00 PM Venue: Port Messe Nagoya Booth Number: 3rd Exhibition Hall, 5-5 We invite everyone to come and visit us! Please feel free to let us know if you need an invitation.
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We will be exhibiting at the Technical Show Yokohama 2020 from February 5 (Wednesday) to February 7 (Friday).
We will be exhibiting at the 41st Industrial Technology Exhibition "Technical Show Yokohama 2020," which will be held at Pacifico Yokohama from February 5 (Wednesday) to February 7 (Friday), 2020. This exhibition is one of the largest comprehensive trade shows for industrial technology and products in Kanagawa Prefecture. It has established a solid position in the metropolitan area as a comprehensive industrial exhibition covering both hard and soft aspects, including materials, components, research and development, manufacturing, as well as welfare and environmental issues. We look forward to your visit.
Aboutマイクロモジュールテクノロジー
Declaration of a module revolution with the latest implementation technology!
Our company pursues bare chip direct mounting and micro joining technology for substrate interconnection, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness through efforts to miniaturize, slim down, enhance functionality, and strengthen cost competitiveness of all products. In particular, we carry out the miniaturization and modularization of circuit mounting substrates through bare chip direct mounting, from concept development and design to prototyping, evaluation, analysis, and mass production. We also provide a one-stop service through our in-house factory to offer reasonable solutions. We will realize bare chip direct mounting, which has been difficult to implement due to cost constraints for small-scale production, through our module technology and manufacturing capabilities. Additionally, the cleanroom class within our factory ranges from 100 to 1000. Please feel free to consult us when considering the miniaturization, slimness, and modularization of circuit mounting substrates for electronic devices.