We will be exhibiting at Nepcon Japan from January 15 (Wednesday) to January 17 (Friday), 2020.
マイクロモジュールテクノロジー
We will be exhibiting at the "NEPCON Japan: Semiconductor and Sensor Packaging Technology Exhibition" held at Tokyo Big Sight from January 15 (Wednesday) to January 17 (Friday), 2020. This exhibition is a specialized event showcasing packaging technologies for electronic devices, including semiconductors and sensors. In the semiconductor and sensor industry, which is expected to expand due to IoT, automotive, and wearable technologies, this event provides an excellent opportunity for engineers from manufacturers of semiconductors, sensors, electronic devices, and automobiles to engage in business discussions.
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Date and time Wednesday, Jan 15, 2020 ～ Friday, Jan 17, 2020
- Capital Venue: Tokyo Big Sight
- Entry fee Free If you do not have an invitation ticket, the admission fee is 5,000 yen per person.