Development and manufacturing of semiconductor and sensor packaging & camera modules.
One-stop support for the development and prototyping of semiconductor and sensor packaging, as well as semiconductor modules, utilizing semiconductor bare chip mounting technology for small to medium-scale production.
We provide one-stop support from the development of semiconductor bare chip mounting and small-sized mounting modules using micro-joining technology to small and medium-scale mass production. We also accept contract manufacturing for cameras. If you are facing any of the following issues, please feel free to contact us! 【Module Development and Mounting Technology Development Services】 ■ We want to miniaturize the mounting substrate but lack specialists. ■ We want to develop new mounting methods. 【Prototyping Services】 ■ We want to create principle prototypes and engineering samples. ■ We want to conduct mounting prototypes for evaluating components and materials. 【Small to Medium Scale Mass Production Services】 ■ We do not have a factory for mass production of several dozen to tens of thousands of units per month. ■ We want to carry out mass production at a domestic facility. We want to mass-produce special mounting modules. We also offer ultra-compact CMOS camera modules. Shape and angle changes are possible, and they are equipped with auto white balance noise reduction and automatic exposure control functions.
basic information
For more details, please contact us or download from the link below.
Price range
Delivery Time
Applications/Examples of results
- Ultra-compact USB camera module - Development of "SiC power module" - Realization of ultra-compact/high-precision sensor package through the fusion of plastic molding and circuit board technology along with fine mounting techniques - Achievement of compact/high-reliability sensor package utilizing wire bonding and transfer molding technology - Various flip chip mounting
