Micro Module Technology Corporation - Business Overview
One-stop support for miniaturization and modularization of circuit boards using bare chip mounting, from concept to mass production!
We specialize in micro-joining technologies centered on bare chip mounting and inter-board bonding, providing support services that enable miniaturization, thinning, and high-function modularization of circuit boards. We offer one-stop support from concept planning through design, prototyping, evaluation, analysis, and small-to-medium scale production. Utilizing our in-house cleanroom facilities (Class 100–1000), customers can proceed with confidence even without in-house expertise or equipment. 【Benefits of Bare Chip Mounting】 ■Added Value ・Miniaturization and thinning expand product applications and contribute to the creation of new markets. ・Integrating semiconductor back-end processes enhances manufacturing value. ■Improved Cost Competitiveness ・Miniaturization and shared design improve production efficiency and help reduce material costs. ・Compared with SoC-based approaches, development costs can be significantly reduced in some cases. Effects vary depending on development conditions and specifications. ■Performance Improvement ・Eliminating secondary wiring shortens interconnections and improves electrical performance. ・Reduced wiring loss contributes to higher-speed operation and improved high-frequency characteristics. ■Environmental Considerations ・Reducing the number of materials used helps decrease waste and environmental impact.
basic information
【Business Description】 Development, prototyping, evaluation, and analysis for miniaturization of printed circuit boards using bare chip mounting ■ Various flip-chip mounting technologies ■ Prototyping and evaluation of wire bonding and bump processing (stud bump) ■ Development, manufacturing, and sales of camera modules ■ Development and prototyping of next-generation power modules If you have any of the following challenges, please feel free to contact us. 【Module Development & Mounting Technology Services】 ■ You want to miniaturize mounting boards but lack in-house expertise ■ You want to develop new mounting or assembly processes 【Prototyping Services】 ■ You want to create proof-of-concept prototypes or engineering samples ■ You want to perform mounting prototypes on special substrates, individual chips, or individual boards ■ You want to conduct mounting prototypes for component or material evaluation 【Small-to-Medium Scale Production Services】 ■ You do not have a facility capable of producing from several tens to tens of thousands of units per month ■ You want to carry out volume production in Japan, including specialized mounting modules 【Evaluation & Analysis Services】 ■ You are experiencing issues in semiconductor assembly but cannot identify the root cause ■ You want to conduct reliability or durability testing but are unsure how to proceed ■ You want to evaluate quality across various mounting processes For more details, please download the catalog or contact us.
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Applications/Examples of results
■ Camera Modules (Packaging of image sensors; MCM integrating DSPs, driver ICs, and power management ICs) ■ IC Tag Modules (Flip-chip mounting of RFID chips) ■ GPS Modules (MCM integrating RF chips and signal processing ICs, etc.) ■ LED Modules (Wire bonding and flip-chip mounting of micro LED chips) ■ LCD Modules (Driver IC mounting and board-to-board interconnection between panel and FPC) ■ Various Multi-Chip Modules (Miniaturization of signal processing and control circuit blocks, etc.) For more details, please feel free to contact us.
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We provide one-stop support for the miniaturization and thinning of electronic devices through bare chip direct mounting technology. Micro Module Technology Co., Ltd. specializes in micro-joining technologies for bare chip direct mounting and interconnection between substrates. We pursue manufacturing solutions that enable miniaturization, higher functionality, and improved cost competitiveness of electronic devices. For the downsizing and modularization of printed circuit boards, we offer integrated support covering concept planning, design and development, prototyping, evaluation and analysis, and mass production. By operating our own in-house manufacturing facilities, we realize a one-stop service and provide bare chip direct mounting technologies at more reasonable costs, which were previously difficult to adopt for small-lot production due to cost constraints. Our factory is equipped with cleanroom environments of Class 100 to 1000, enabling the production of high-quality modules and printed circuit boards. If you are considering miniaturization, thinning, or modularization of electronic circuit boards, please feel free to contact us.