Micro Module Technology Corporation - Business Overview
Support for miniaturization and modularization of circuit implementation boards using bare chip implementation, from concept to prototype to mass production!
We pursue micro-joining technology for bare chip mounting and inter-board connections, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness. From concept to development design, prototyping, evaluation, analysis, and small to medium-scale mass production, we provide a one-stop service at our in-house factory (clean room class: 100 to 1000). We will realize bare chip mounting, which has been difficult to implement cost-effectively for small-scale production, through our module technology and manufacturing capabilities. **Benefits of Bare Chip Mounting** - **Increased Added Value** → Miniaturization and thinning expand product applications and create new markets. → Incorporating semiconductor backend processes enhances manufacturing added value. - **Improved Cost Competitiveness** → Miniaturization and standardization improve production efficiency and reduce material costs. → Compared to miniaturization through System on Chip (SoC), development costs can be reduced to about one-tenth. - **Enhanced Performance** → The elimination of secondary wiring in semiconductor packages significantly shortens wiring length, improving performance degradation due to wiring loss. - **Environmental Considerations** → Reducing the number of materials used can decrease waste.
basic information
**Business Content** - Development, prototyping, evaluation, and analysis of circuit boards for miniaturization using bare chip mounting - Various flip chip mounting - Prototyping and evaluation of wire bonding and bump processing (stud bumps) - Development, manufacturing, and sales of camera modules - Development and prototyping of next-generation power modules If you are facing such issues, please feel free to contact us! **<Module Development and Mounting Technology Development Services>** - Want to miniaturize mounting boards but lack expertise - Want to develop new mounting methods **<Prototyping Services>** - Want to create principle prototypes or engineering samples - Want to prototype mounting on special boards or individual chips and substrates - Want to prototype mounting to evaluate components and materials **<Small to Medium Scale Mass Production Services>** - Do not have a factory for mass production of several dozen to tens of thousands of units per month - Want to conduct mass production at a domestic location. Want to mass-produce special mounting modules **<Evaluation and Analysis Services>** - Experiencing issues with semiconductor mounting but do not know the cause - Want to conduct reliability or durability evaluations but do not know how - Want to conduct quality evaluations using various mounting methods For more details, please download the catalog or contact us.
Price information
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Applications/Examples of results
◆Camera module (packaging of image sensor, DSP, driver, power chip MCM) ◆IC tag module (flip chip implementation of RFID chip) ◆GPS module (MCM of RF chip, signal processing chip, etc.) ◆LED module (wire bonding of LED microchips, flip chip implementation) ◆LCD module (driver chip implementation, panel-FPC interconnection) ◆Various multi-chip modules (miniaturization of signal processing, control circuit blocks, etc.) For more details, please contact us.
