Development and manufacturing of semiconductor and sensor packaging & camera modules.
Leave the prototyping and implementation of sensors and camera modules to us!
We have a track record of prototyping and implementing ultra-small sensors and camera modules using bear chip implementation and micro-joining technology. Additionally, we develop, manufacture, and sell our original camera modules under the "IKURA series."
basic information
I have experience in the development and prototyping of custom sensor modules and camera modules. I can implement various sensors, including CMOS sensors. Product examples: spectral sensors, color temperature sensors, odor sensors, etc. For more information about the "IKURA series," click here. For details, please download the catalog or contact us.
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We provide one-stop support for the miniaturization and thinning of electronic devices through bare chip direct mounting technology. Micro Module Technology Co., Ltd. specializes in micro-joining technologies for bare chip direct mounting and interconnection between substrates. We pursue manufacturing solutions that enable miniaturization, higher functionality, and improved cost competitiveness of electronic devices. For the downsizing and modularization of printed circuit boards, we offer integrated support covering concept planning, design and development, prototyping, evaluation and analysis, and mass production. By operating our own in-house manufacturing facilities, we realize a one-stop service and provide bare chip direct mounting technologies at more reasonable costs, which were previously difficult to adopt for small-lot production due to cost constraints. Our factory is equipped with cleanroom environments of Class 100 to 1000, enabling the production of high-quality modules and printed circuit boards. If you are considering miniaturization, thinning, or modularization of electronic circuit boards, please feel free to contact us.