Cutting-edge technology that realizes miniaturization and high performance of semiconductors!
Bear chip mounting, flip chip mounting, wire bonding, and stud bumping. We support all types of board mounting!
We implement semiconductor bare chips on various circuit boards using a variety of methods. It is possible to mount semiconductor bare chips and peripheral passive components on glass epoxy boards, ceramic boards, three-dimensional wiring boards (MID), flexible boards, glass boards, and silicon boards. Furthermore, we flexibly handle the development, prototyping, and small to medium-scale production of small modules and semiconductor packages, including BGA packages, power modules, and image sensor packages. We also perform specific tasks such as wire bonding only and special mounting, accepting orders starting from just one piece.
basic information
**Core Technologies** 〇 Bump Formation & Wire Bonding Technology - Stud Bump Bonding (Φ25m/40um Pitch) - Multi-layer Bump Formation (2-layer to 3-layer Bump (Φ40um/50um Pitch) - Wire Bonding (40um Pitch) - Wedge Bonding (Al, Au) - Solder Bump 〇 Flip Chip Bonding Technology - Ultrasonic Joining (GGI) - Conductive Adhesive Connection (SBB) - Micro Soldering (C4/Cu pillar) - Thermal Compression Bonding (ACF/ACP/NCP etc.) - Au Solder Joint (GBS) 〇 Ultra-Compact Module Technology - COF Module - COM Module - COC Module - FOB Module - Next-Generation Power Module Technology - Flip Chip Sensor Module 〇 Encapsulation Technology - Underfill (Flip Chip) - Side Fill Encapsulation (Image Sensor etc.) - Potting/Dam & Fill Encapsulation (Wire Bonding) - Transfer Molding For more details, please download the catalog or contact us.
Price information
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For more details, please contact us.
