Molding and Processing: Miorex PGX-595 (HG)
A highly reliable grade with excellent heat resistance, mechanical strength, and dimensional stability!
The Miolex series is a product that combines excellent thermal insulation, mechanical strength, outstanding dimensional stability, exceptional cost performance, safety without the use of asbestos, electrical insulation, and machinability. 【PGX-595(HG) (Basic Grade)】 Heat resistance temperature (°C): 400 Compression creep (％): 0.08 Bending strength (MPa): 120–130 Compression strength (MPa): 420–480 Impact strength (J/cm): 2.5 Thermal expansion rate (1/°C): 2.3×10^5 Thermal conductivity (W): 0.3 Volume resistivity (Ω-cm): FW,★1=10^15, FW,★2=10^13 Water absorption rate: 0.1 Specific gravity: 2.0–2.1 Our company performs precision machining of PGX-595(HG) using numerous machine tools in a temperature-controlled environment 24 hours a day. *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Handled Resins ※Partial】 ■Thermosetting Resins Phenol, Epoxy, Inorganic, Unsaturated Polyester, Polyester ■Thermoplastic Resins Methyl Methacrylate, Polyvinyl Chloride, MC Nylon, Polyacetal, Homopolymer, High Molecular Weight Polyethylene, Polyether Ether Ketone, Polyethylene Terephthalate, Methacrylate, Polycarbonate, Trifluoroethylene, Tetrafluoroethylene, Polypropylene, Polyethylene, Homopolymer, Nylon 6, Nylon 66, ABS, Polybutylene Terephthalate, Polyphenylene Sulfide, Polysulfone, TI Polymer ※For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Insulation plates for IC molding machines ■ Insulation plates for precision molds ■ Jigs for transporting and inspecting electronic components ■ Insulation plates for thixomolding ■ Semiconductor manufacturing equipment ■ Insulation plates for injection molding *For more details, please refer to the PDF materials or feel free to contact us.
