Molded and Processed Heat-Resistant Organic Laminated Board PGE-6771
High mechanical strength not found in inorganic systems! You can gain benefits such as energy savings and improved yield.
This is a laminated board that has been improved with our unique technology to enhance strength and heat resistance. Its greatest feature is the high mechanical strength that is not found in inorganic materials. 【PGX-595(HG) (Basic Grade)】 Heat resistance temperature (°C): 200 Compression creep rate (%): 0.12 Bending strength (MPa): 450–540 Compression strength (MPa): 500–580 Impact strength (J/cm): >4.5 Thermal expansion rate (1/°C): 6.5×10^5 Thermal conductivity (W): 0.3 Volume resistivity (Ω-cm): FW,★1=10^15, FW,★2=10^14 Water absorption rate: 0.05 Specific gravity: 1.8–1.9 We perform precision machining of PGE-6771 using numerous machine tools in a temperature-controlled environment for 24 hours. *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Handling Resins *Partial List】 ■Thermosetting Resins Phenolic, Epoxy, Inorganic, Unsaturated Polyester, Polyester ■Thermoplastic Resins Methyl Methacrylate, Polyvinyl Chloride, MC Nylon, Polyacetal, Homopolymer, High Molecular Weight Polyethylene, Polyether Ether Ketone, Polyethylene Terephthalate, Methacrylate, Polycarbonate, Trifluoroethylene, Tetrafluoroethylene, Polypropylene, Polyethylene, Homopolymer, Nylon 6, Nylon 66, ABS, Polybutylene Terephthalate, Polyphenylene Sulfide, Polysulfone, TI Polymer *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Insulation board for injection molding ■ Insulation board for blow molding ■ Insulation board for rubber molding machines ■ Insulation board for precision molds *For more details, please refer to the PDF document or feel free to contact us.
