All products and services
61~90 item / All 737 items
-
List of reliability tests
Reliability Test
last updated
-
Evaluation of local thermal conductivity by SThM
It is possible to visualize the phase separation structure of polymers from thermal conductivity information.
last updated
-
Semi-quantitative analysis using a corona charged particle detector (CAD)
Here is an example of the semi-quantification of the eight catechin components contained in green tea.
last updated
-
Features and Principles of the Corona Charged Particle Detector (CAD)
Here is an example comparing the analysis results of catechin standard solutions using CAD and UV detectors.
last updated
-
Contract analysis service for in situ measurement using X-ray CT.
It is possible to observe three-dimensional structures under heating/cooling and stress/compression load conditions.
last updated
-
What can be understood from first-principles calculations.
We will introduce the target of analysis, the physical property information obtained, and examples of analysis.
last updated
-
Structural analysis using Xe-plasma FIB.
Precision processing/structural evaluation is possible over a wide area of several hundred micrometers.
last updated
-
[Analysis Case] Evaluation of the Distribution of Active Ingredients in Tablets
The distribution of main components and additives can be visualized.
last updated
-
Gas Chromatograph - Time-of-Flight Mass Spectrometer
A method for separating components by analyzing volatile components and utilizing differences in gas adsorption or distribution coefficients with respect to the stationary phase.
last updated
-
Selection of Ionization Methods for TG-DTA-MS: EI Method and PI Method
TG-DTA-MS Thermogravimetric Differential Thermal Mass Spectrometry
last updated
-
What can be understood from molecular dynamics calculations
We will introduce the target of analysis, the physical property information obtained, and examples of analysis that can be understood from molecular dynamics calculations.
last updated
-
Laser processing
Using an ultra-short pulse laser with micron-level processing position accuracy, samples can be produced quickly and with low damage.
last updated
-
Identification of resistance anomalies due to absorption current
You can identify high resistance and open areas in the wiring from the absorption current image.
last updated
-
Electronic dyeing
By bonding heavy elements to polymer chains, the contrast of structures and forms derived from the polymers can be enhanced, allowing for clearer observation under an electron microscope.
last updated
-
Cross-sectional processing using the ion polish method.
A method for removing the surface of a sample by utilizing the sputtering phenomenon, where sample atoms are ejected from the sample surface.
last updated
-
SSDP-SIM
SSDP: Substrate Side Depth Profile
last updated
-
[TG-DTA, -MS] Thermogravimetric Differential Thermal Analysis, Differential Thermal Balance - Mass Analysis Method
TG-DTA simultaneously evaluates weight changes caused by heating (TG) and thermal behavior of endothermic and exothermic reactions (DTA).
last updated
-
[AFM-MA・DMA] Mechanical Property Evaluation (Elastic Modulus and Dynamic Viscoelasticity)
AFM-MA and AFM-DMA are analyses that can provide insights into hardness.
last updated
-
[O-PTIR] PTIR detection method submicron infrared spectroscopy
Infrared spectroscopy is a method for obtaining information about molecular structure by measuring the infrared absorption due to molecular vibrations.
last updated
-
AFM Infrared Spectroscopic Analysis
Infrared spectroscopy is a method for obtaining information about molecular structure by measuring infrared absorption due to molecular vibrations.
last updated
-
[Analysis Case] Component Analysis of Additives in Rubber Products
We will conduct a comprehensive qualitative evaluation of vulcanization accelerators, aging inhibitors, lubricants, and other substances in rubber products.
last updated
-
ESD test
We evaluate the effects and destruction tolerance when semiconductors and electronic components are subjected to stress from static electricity.
last updated
-
PIND test
By detecting the sound generated when tiny foreign objects inside the hollow structure collide with the wall, it is possible to prevent troubles such as shorts before they occur.
last updated
-
TCC (Rapid Temperature Change) Test
Temperature cycle testing is possible with sample temperature control and air temperature control.
last updated
-
Solder heat resistance test
We will evaluate the impact of thermal stress on electronic components in the implementation process.
last updated
-
Solder Wetting Test
Testing can be conducted using the solder pot balance method, solder ball balance method, and solder paste method.
last updated
-
Air tightness test
We evaluate and determine the sealing performance of sealed states in hollow structure components and the like.
last updated
-
Constant temperature and humidity test
It is possible to evaluate the resistance when a certain load (temperature, humidity, pressure, voltage) is applied to materials and components.
last updated
-
Impact test
We evaluate the impact of shocks and durability that electronic components, electronic devices, and other products experience during use or when dropped.
last updated
-
Vibration test
We evaluate the effects of vibrations and durability on electronic components, electronic devices, and other products during use or transportation.
last updated