August Webinar Announcement

名菱テクニカ三菱電機グループ

【August WEB Seminar (Duration: 30 minutes)】 You can easily participate for free in this WEB seminar using ZOOM! The seminars in August will feature the following two sessions. [Session 1] Introduction of the exhibition content from the Total Solution Exhibition for Electronic Devices 2023 held at Tokyo Big Sight from May 31 to June 2 (Exhibition content: Circuit board cutting machine + Robot transportation system). Automation can be achieved from circuit board supply to discharge. [Session 2] A circuit board marking device that allows for double-sided printing and is space-saving due to the built-in flipping mechanism, eliminating the need for an external flipping device, along with the benefits of the built-in flipping mechanism. ----▼ Click here to register ▼--------------------------------------------- By clicking the "Details & Registration" button below, you can confirm the details and register! ------------------------------------------------------------------------

Date and time Wednesday, Aug 23, 2023
01:00 PM ～ 03:00 PM
If the schedule does not match, we will hold individual seminars, so please feel free to contact us.
Capital
Entry fee Free

Related product information

Automation of factory production leads to labor saving! Circuit board separator "Robot Transport System"
【Monthly Web Seminars Now Held!】Automating the processes from PCB supply to PCB cutting, palletizing onto output trays, and PCB discharge!

【Other Features】 ■ It is possible to track production information by uploading equipment operation data such as model type, device number, lot number, start time of operation, and end time of operation. ■ Automatic turn system with two tables - It allows for the removal of split substrates and the setting of the next substrate in parallel with substrate splitting, which reduces the waiting time of the splitter and shortens the cycle time. ■ The multi-joint robot for loader/unloader is equipped with a travel axis - It can be retracted during maintenance of the splitting spindle and when changing setups (fixture replacement) due to model changes of printed circuit boards. - It enhances work efficiency and ensures safety. *For more details, please refer to the PDF document or feel free to contact us.
Supports automation! Achieves high productivity with the 'turntable-type circuit board separator'.
Improvement of productivity through parallel setup in the printed circuit board division process, also accommodating inline production processes!

【Specifications (Excerpt)】 ■Table: 2 tables (automatic turn method) ■Target board size (length × width): 250mm × 350mm, compatible with M size boards ■Board handling ・Board material: Glass epoxy (FR-4), resin boards such as CEM-3 Thickness: 0.4 to 2.0mm ・Positioning method: Positioning using jigs ■Basic performance ・X-Y axis positioning method: 2-axis AC servo control ・X-Y axis movement speed: Maximum 1,200mm/s ・Repeat positioning accuracy: ±0.01mm *For more details, please download the PDF or contact us.
Laser marking device
High-quality fine printing is possible! Laser marking device for substrates compatible with a wide range of materials.

【Specifications (Excerpt)】 ■ Target board size (length × width): 50mm × 80mm to 250mm × 330mm M size 　※ For L size and small boards, please consult us. 　　　　　　　　　　 ■ Print head manufacturer: Panasonic Industry ■ Laser type: Fiber laser, CO2 laser ■ Printed characters: Two-dimensional codes: QR code, Micro QR code, DataMatrix 　　　　　　　　　Others: One-dimensional codes, alphanumeric characters, special characters, shapes ■ Device dimensions (approximate): W850 × D1290 × H1460 (excluding signal tower, etc.) 　※ For more details, please download the PDF or contact us. 　※ If you want to know detailed specifications, please download the detailed specification catalog from the catalog.
Inline-compatible router-type circuit board splitter
Inline model that automates the printed circuit board cutting process.

【Specifications (Excerpt)】 ■ Maximum size of target substrate (length × width): 250mm × 350mm, compatible with M size substrates ■ Substrate handling 　・Substrate type: Glass epoxy (FR-4), resin substrates such as CEM3 　・Positioning method: Positioning using jigs ■ Basic performance 　・X-Y axis positioning method: 2-axis AC servo control 　・X-Y axis movement speed: Maximum 500mm/s 　・Repeat positioning accuracy: ±0.02mm, etc. ■ Equipment dimensions 　・3422W × 1340D × 2000H, approximately 1000kg
Router-type circuit board separator "MR2535H2"
Standalone type with high rigidity and quality, equipped with e-F@ctory utilization error prevention features, automatic router bit exchange, and image teaching capabilities.

【Specifications (Excerpt)】 ■ Maximum size of target substrate (length × width): 250mm × 350mm, compatible with M size substrates ■ Substrate handling 　・Substrate materials: Glass epoxy (FR-4), CEM3 and other resin substrates 　・Board thickness: 0.4 to 2.0mm 　・Positioning method: Positioning by jig ■ Basic performance 　・X-Y axis positioning method: 2-axis AC servo control 　・X-Y axis movement speed: Maximum 1,200mm/s 　・Repeat positioning accuracy: ±0.01mm, etc. ■ Device dimensions (approximate): 790W × 1140D × 1670H (including touch panel, excluding indicator lights) *For more details, please download the PDF or contact us.