名菱テクニカ 三菱電機グループ Official site

【Monthly Web Seminars Now Held!】Automating the processes from PCB supply to PCB cutting, palletizing onto output trays, and PCB discharge!

【Other Features】 ■ It is possible to track production information by uploading equipment operation data such as model type, device number, lot number, start time of operation, and end time of operation. ■ Automatic turn system with two tables - It allows for the removal of split substrates and the setting of the next substrate in parallel with substrate splitting, which reduces the waiting time of the splitter and shortens the cycle time. ■ The multi-joint robot for loader/unloader is equipped with a travel axis - It can be retracted during maintenance of the splitting spindle and when changing setups (fixture replacement) due to model changes of printed circuit boards. - It enhances work efficiency and ensures safety. *For more details, please refer to the PDF document or feel free to contact us.

Improvement of productivity through parallel setup in the printed circuit board division process, also accommodating inline production processes!

【Specifications (Excerpt)】 ■Table: 2 tables (automatic turn method) ■Target board size (length × width): 250mm × 350mm, compatible with M size boards ■Board handling ・Board material: Glass epoxy (FR-4), resin boards such as CEM-3 Thickness: 0.4 to 2.0mm ・Positioning method: Positioning using jigs ■Basic performance ・X-Y axis positioning method: 2-axis AC servo control ・X-Y axis movement speed: Maximum 1,200mm/s ・Repeat positioning accuracy: ±0.01mm *For more details, please download the PDF or contact us.

Standalone type with high rigidity and quality, equipped with e-F@ctory utilization error prevention features, automatic router bit exchange, and image teaching capabilities.

【Specifications (Excerpt)】 ■ Maximum size of target substrate (length × width): 250mm × 350mm, compatible with M size substrates ■ Substrate handling 　・Substrate materials: Glass epoxy (FR-4), CEM3 and other resin substrates 　・Board thickness: 0.4 to 2.0mm 　・Positioning method: Positioning by jig ■ Basic performance 　・X-Y axis positioning method: 2-axis AC servo control 　・X-Y axis movement speed: Maximum 1,200mm/s 　・Repeat positioning accuracy: ±0.01mm, etc. ■ Device dimensions (approximate): 790W × 1140D × 1670H (including touch panel, excluding indicator lights) *For more details, please download the PDF or contact us.

High-quality fine printing is possible! Laser marking device for substrates compatible with a wide range of materials.

【Specifications (Excerpt)】 ■ Target board size (length × width): 50mm × 80mm to 250mm × 330mm M size 　※ For L size and small boards, please consult us. 　　　　　　　　　　 ■ Print head manufacturer: Panasonic Industry ■ Laser type: Fiber laser, CO2 laser ■ Printed characters: Two-dimensional codes: QR code, Micro QR code, DataMatrix 　　　　　　　　　Others: One-dimensional codes, alphanumeric characters, special characters, shapes ■ Device dimensions (approximate): W850 × D1290 × H1460 (excluding signal tower, etc.) 　※ For more details, please download the PDF or contact us. 　※ If you want to know detailed specifications, please download the detailed specification catalog from the catalog.