展示会情報
展示会情報
展示会への出展情報や過去の展示会の出展状況をご紹介します。
1～6 item / All 6 items
-
Report on the 2025 Total Solutions Exhibition for Electronic Devices
We exhibited the "PCB Separator" and "Turntable PCB Separator" that can be chosen based on production volume, as well as the "PCB Marking Device" that can accommodate a wide range of materials.
last updated
-
Report on the 2024 Total Solutions Exhibition for Electronic Devices
We exhibited the "new type substrate marking device" that supports a wide range of materials with high-quality fine printing and the "turntable-type substrate cutting machine."
last updated
-
Report on the 2023 Total Solutions Exhibition for Electronic Devices
We exhibited a "board cutting machine + robot transport system" that supports the automation of the printed circuit board cutting process.
last updated
-
The 37th NePCON Japan 2023: First Exhibition of the H2T Circuit Board Divider Machine
We made our first exhibition of the turntable-type circuit board cutting machine MR2535H2T.
last updated
-
Notice of Participation in the 40th Internepcon Japan
We will exhibit a "turntable-type substrate cutting machine" that allows parallel setup during substrate cutting and a "substrate marking device" that can accommodate a wide range of materials!
last updated
-
Invitation to Exhibit at the Total Solutions for Electronic Devices Exhibition 2026
We will exhibit the "turntable substrate cutting machine" that allows parallel setup during substrate cutting and the "laser substrate marking device" that can handle a wide range of materials!
last updated