The 37th NePCON Japan 2023: First Exhibition of the H2T Circuit Board Divider Machine
We made our first exhibition of the turntable-type circuit board cutting machine MR2535H2T.
We will demonstrate and introduce high productivity through parallel setup during substrate processing. Additionally, we proposed a reduction in man-hours and costs through in-house production of jigs using the implementation substrate division system 'Jig-Designer.' In the February seminar, we will present the exhibition content from Internepcon Japan, which was held at Tokyo Big Sight from January 25 to 27. If you are interested, please join us via the "Web Seminar Registration."
basic information
【Event Name】37th NePCON Japan - Electronics Development and Implementation Exhibition - 【Dates】January 25, 2023 [Wed] to January 27, 2023 [Fri] 10:00 AM to 5:00 PM 【Venue】Tokyo Big Sight 【Organizer】RX Japan Co., Ltd.
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Applications/Examples of results
【Features】 ■ Equipped with two tables using a parallel setup automatic turn method ■ Adaptable to general inline specifications through the use of robots ■ Reduction of cutting time by setting Z-axis height for each router location ■ Improved operational efficiency by monitoring bit usage distance and enabling automatic replacement ■ Built-in dust collector achieves compact device size
