Report on the 2024 Total Solutions Exhibition for Electronic Devices
We exhibited the "new type substrate marking device" that supports a wide range of materials with high-quality fine printing and the "turntable-type substrate cutting machine."
Under the theme of "New Solutions for Cutting-Edge Class Printed Circuit Board Manufacturing," we exhibited the "New PCB Marking Device" and "PCB Separator" at the Mitsubishi Electric Corporation booth. The "New PCB Marking Device" offers high-speed fine printing of two-dimensional codes and characters necessary for the traceability of printed circuit boards, as well as high-resolution printing compatible with various materials. For the "PCB Separator," we proposed a highly productive device that allows for parallel setup during PCB separation using a turntable system. Thank you for visiting us. ★ Our company is hosting various seminars, starting with the exhibited machines. If you are interested, please join us through the "Web Seminar Registration."
basic information
【Exhibition Name】Total Solutions for Electronic Devices Exhibition 2024 【Dates】June 12, 2024 (Wednesday) to June 14, 2024 (Friday) 10:00 AM to 5:00 PM 【Venue】Tokyo Big Sight, East Hall 6, Mitsubishi Electric Booth (Booth No. 6G-42)
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Applications/Examples of results
【Circuit Board Marking Device: Features】 ■ Compatible with various materials such as metal and ceramics using fiber laser ■ Reduction in total cost due to higher precision printing and longer lifespan compared to CO2 laser ■ Capable of printing in small space areas due to fine printing 【Circuit Board Cutting Machine: Features】 ■ Equipped with two tables in an automatic turn system that allows for parallel setup ■ Adaptable to general inline specifications through the use of robots ■ Reduction in cutting time by setting Z-axis height for each router location ■ Built-in dust collector achieves compact device size
