Notice of Participation in the 40th Internepcon Japan
We will exhibit a "turntable-type substrate cutting machine" that allows parallel setup during substrate cutting and a "substrate marking device" that can accommodate a wide range of materials!
We will be showcasing the actual machines of the "Turntable-type PCB Separator" and "Laser PCB Marking Device" under the theme of "Solutions that contribute to solving challenges in the production field." We propose the "PCB Separator," a highly productive turntable-type PCB separator 'MR2535H2T' that allows for parallel setup during PCB separation. For the "Laser PCB Marking Device," we offer high-resolution printing that supports fine printing of two-dimensional codes and characters necessary for the traceability of printed circuit boards, as well as compatibility with various materials. We invite you to visit our booth (East Hall 4, Booth No. E4-17). ★ A commemorative gift will be given to the first customers who visit the booth.
basic information
【Event Name】The 40th Internepcon Japan 【Dates】January 21, 2026 (Wednesday) to January 23, 2026 (Friday) 10:00 AM to 5:00 PM 【Venue】Tokyo Big Sight, East Hall 4, Mitsubishi Electric Booth (Booth No. E4-17)
Price range
Delivery Time
Applications/Examples of results
【PCB Cutting Machine: Features】 - Equipped with two tables for automatic turn operation that allows parallel setup - Adaptable to general inline specifications through the use of robots - Reduction in cutting time by setting Z-axis height for each router location - Built-in dust collector achieves compact device size 【PCB Marking Machine: Features】 - Laser heads available in two types: fiber laser and CO2 laser - Fiber laser accommodates a variety of materials, including metals and ceramics - Fiber laser offers higher precision printing and longer lifespan, resulting in total cost reduction compared to CO2 laser - Optional built-in reversing mechanism enables double-sided marking as well.
Line up（3）
| Model number | overview |
|---|---|
| MR2535H2T | Turntable-type circuit board separator |
| ML-PM20F | Fiber laser substrate marking device |
| ML-30C3 | CO2 laser substrate marking device |
catalog（2）
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Since its establishment in 1980, when it was separated from Mitsubishi Electric Nagoya Works in the facilities and materials division, our company has been a member of the Mitsubishi Electric Group. Through various contract operations, we have nurtured our manufacturing capabilities and provided products and services related to various FA and mechatronic equipment to our customers. Moving forward, we will continue to contribute to solving the challenges faced in our customers' production sites by working on improving our comprehensive capabilities in manufacturing, including skill inheritance, production innovation, and quality improvement activities. As a trusted partner to our customers, we will value communication with them and deliver products and services that meet their satisfaction.