Copper pyrophosphate plating additive "CP-25"
The plating solution is weakly alkaline and is a bivalent copper solution consisting of copper and potassium pyrophosphate!
"CP-25" is an additive for copper pyrophosphate plating that has a dense crystalline structure and excellent corrosion resistance. The pyridine method is recommended for purposes such as providing a glossy and leveling undercoating for zinc die casting, electroforming, preventing carburizing and nitriding of iron and steel, through-hole plating for printed circuit boards, plating of steel wires, and plating on plastics. By simply adding this product, a glossy and leveling plating can be obtained, and adding the additive "CP-3" can further enhance the effect. 【Features】 - Provides a uniform glossy plating with good leveling and flexibility. - The crystalline structure of the film is dense, offering excellent corrosion resistance. - Contains no cyanides, considering environmental impact and costs (waste treatment expenses). - Smooth plating that does not cause roughness even with thick layers. - 100% current efficiency with no pinholes. *For more details, please download the PDF or feel free to contact us.
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【Other Features】 ■ The solution is stable and does not increase carbonate like cyanide baths. ■ The plating solution is weakly alkaline and poses no risk of corroding the base metal. ■ The solution has a buffering effect. ■ The operating temperature is low. ■ Exhaust, diaphragm, anode bags, and PR equipment are not required. *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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